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Rigid PCB Specs

The Pitch

Manufactured in Silicon Valley
On-site inventory of the finest materials, up to 30 layers
1-day turn-times available

The Parameters

Up to 30 layers
Board thickness: .005″ – .250″
Max panel size: 21″ x 29″
Min trace and space: .002″
Solder mask feature tolerance: .001″
Blind & buried vias

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Via Capabilities

Blind Via	Min Total Pad Size	4 mils (.102 mm) over drill size
	Min Laser Drill Size	4 mils (.102 mm)
	Mechanically Drilled Annular Ring	4 mils (.102 mm) over drill size
	Dielectric Material Thickness	2 mils (.051 mm)
	Capture Pad Size	4 mils (.102 mm) over drill size
	Laser Aspect Ratio	.75:1
Buried Via	Min Total Pad Size	5 mils (.127 mm) over drill size
	Min Drill Size	6 mils (.152 mm) – depending on aspect ration
	Capture Pad Size	5 mils (.127 mm) over drill size
	Laser Aspect Ratio	.75:1
Through Hole	Min Total Pad Size	5 mils (.127 mm) over drill size
	Min Drill Size	6 mils (.152 mm)
	Capture Pad Size	5 mils (.127 mm) over drill size
	Max Layer Count	26+
	Min Finish Thickness	.01″ (.254 mm)
	Min Trace Width (I/L)	3 mils (.076 mm)
	Min Trace Width (O/L)	3 mils (.076 mm)
	Min Space Width (I/L)	3 mils (.076 mm)
	Min Space Width (O/L)	3 mils (.076 mm)
	Max Lamination Cycles	4
	Min Hole Size	6 mils (.152 mm)
	Min Pitch	.157″ (.4 mm)
	Stacked Vias	Yes
	Staggered Vias	Yes
	Conductive Filled Vias	Yes
	Non-Conductive Filled Vias	Yes
	Copper Plate Shut Microvias	Yes
	Heat Sinks	Yes
	UL 94V-0 (On Select Materials)	Yes

Quality Reports

Specifications	IPC-6012, Class 1, 2, 3, & 3D	Yes
	IPC-6013, Class 1, 2 & 3	Yes
	31032 MIL-PRF-55110 (On Selected Materials)	Yes
Reports / Certificates	Micro Section	Yes
	Solderability	Yes
	X-Ray Fluorescence	Yes
	Ionic Contamination	Yes
	Time Domain Reflectometry (TDR)	Yes
	First Article Inspection (FAI)	Yes
	Certificate of Compliance (C of C)	Yes
	Electrical Test	Yes

Construction

	Panel Sizes	14×26″ (36×66 cm), 21×25″ (53×64 cm), 21x 29″ (53×74 cm), 12×18″ (30×46 cm), 18×24″ (46×61 cm), 16×18″ (41×46 cm)
	Min Board Thickness	.007″ (.178 mm)
	Max Board Thickness	.25″ (6.4 mm)
	Thickness Tolerance	< 10%
	Bow & Twist Tolerance	< 7%
	Min Core Thickness	.002″ (0.51 mm)
	Min Dielectric	.002″ (.051 mm)
	Min Starting Copper Foil Weight	9 micron (.009 mm)

Preferred Materials*

FR-4 Lead Free	Isola 370 HR	Yes
	Ventec VT47	Yes
	Nan Ya NPG-170	Yes
Polyimide	Isola P95	Yes
	Nelco N7000-2 HT	Yes
	Arlon 85N	Yes
Highspeed FR/MW Applications	Isola I-speed	Yes
	FR 408HRR	Yes
	Nelco N4000-13	Yes
	Nelco N4800-20	Yes
Teflon	Nelco N9000-13 RF	Yes
	Rogers RO3000 Series	Yes
	Rogers RT/DUROID Series	Yes
	Rogers ULTRALAM 2000	Yes
Ceramic	Rogers RO4003	Yes
	Rogers RO4350	Yes
	Rogers TTM 3, 4, 6, 10, 10i	Yes
	Taconics CER-10	Yes
	Taconics RF-35, RF-35A2	Yes
	Taconics RF-60	Yes
Flex	DuPont Pyralux AP	Yes
	DuPont Pyralux LF	Yes
	DuPont Pyralux FR	Yes
	Laird IMPCB	Yes

Drill

	Smallest Laser Drill Diameter	.003″ (.076 mm)
	Largest Laser Drill Diameter	.010″ (.254 mm)
	Max Laser Aspect Ratio	>.75:1
	Min Mechanical Diameter	.005″ (.127 mm)
	Max Mechanical Aspect Ratio	> 10:1
	Min Mechanical Drill to Copper	.005″ (.127 mm)
	Min Plated Through Hole Tolerance	+/- .002” (.051 mm)
	Min Non Plated Through Hole Tolerance	+/- .001” (.025 mm)

Pad Diameter

Rigid	Inner Layer	Drill + .008″ (.203 mm) + Class 2
	Outer Layer	Drill + .006″ (.152 mm) + Class 2
Flex	Inner Layer	Drill + .010″ (.254 mm) + Class 2
	Outer Layer	Drill + .008″ (.203 mm) + Class 2

Conductors

Pad Size	Min Pad Size For Electrical Test	.004″ (.102 mm)
	Min Wire Bond Pad Size	.004″ (.102 mm)
Min Trace Vs Copper Thickness Note: Thickness includes starting foil plus panel plates (for wrap if any) to beetched.	5 microns	.002″ (.051 mm)
	9 microns	.0025″ (.064 mm)
	3/8 oz	.003″ (.076 mm)
	1/2 oz	.0035″ (.089 mm)
	1 oz	.0045″ (.114 mm)
	2 oz	.006″ (.152 mm)
	3 oz	.0065″ (.165 mm)
	> 3 oz	Contact Us
Min Space Vs Copper Thickness Note: Thickness includes starting foil plus panel plates (for wrap if any) to beetched.	5 microns	.0025″ (.064 mm)
	9 microns	.003″ (.076 mm)
	3/8 oz	.0035″ (.089 mm)
	1/2 oz	.004″ (.102 mm)
	1 oz	.005″ (.126 mm)
	2 oz	.0065″ (.165 mm)
	3 oz	.007″ (.178 mm)
	> 3 oz	Contact Us

Permanent Solder Mask

Liquid Photoimageable (LPI)	Colors	Green, Red, Blue, Yellow
	Gloss	Semi-Gloss, Matte (Only In Green)
	Min Dam/Web Size SMT	.004″ (.102 mm)
	Min Dam/Web Size BGA	.0035″ (0.89 mm)
	Clearance	>.0005″ (.013 mm)
	Mask-Defined SMT Or BGA (Not Ground Plane)	Yes
	Mask-Defined Features On Ground Plane	Yes
Laser Direct Imaging (LDI)	Colors	Green, Black, Red, Blue
	Gloss	Semi-Gloss
	Min Web for SMT	.004″ (.102 mm)
	Min Web for BGA	.0035″ (.089 mm)
	Clearance	.005″ (.126 mm)
	Mask-Defined SMT Or BGA (Not Ground Plane)	Yes

Legend

Sprint	Color	White
	Min Line	.050″ (1.27 mm)
	Min Heigth	.025″ (.635 mm)
Screen Printable	Colors	White, Yellow, Black, Red
	Min Line	.007″ (.178 mm)
	Min Heigth	.030″ (.762 mm)

Surface Finishes

	HASL (Vertical & Horizontal)	Yes
	Lead Free HASL	Yes
	OSP (Shikoku F2 & Entek)	Yes
	ENIG (Electroless Nickel / Immersion Gold)	Yes
	ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold)	Yes
	Immersion Silver	Yes
	Tin Nickel	Yes
	Electrolytic Soft Gold	Yes
	Electrolytic Hard Gold	Yes

Fabrication

Mechanical	Min Route Cutter Available	.021″ (.533 mm)
	Routed Part Size Tolerance	<.010″ (.254 mm)
	Counter Sink	Yes
	Counter Bore	Yes
	Bevel Angles	20, 30, 45
Laser	Milling, Depth Tolerance	+/- .003″ (.076 mm)
	Laser Routed Thickness	<.032″ (.813 mm) Thick
	Routed Array	Yes
V Score	Angles	30, 45, 60
	Edge to Copper	.007″ (.178 mm)
Dicing	Edge to Copper	.005″ (.127 mm)
Edge / Castellation	Min Drill Via	.010″ (.254 mm)
	Edge Plating	Yes

Other Screenable Materials

	Carbon Ink	Yes
	Peelable Solder Mask	Yes

Electrical Test

	Controlled Impedance	5% w/ F/A
	Hi Pot	Yes
	Test Voltage	40, 250, 500
	Isolation Resistance (Mohms)	>100
	Continuity Resistance (Ohms)	<.010
	Min Pad Size	.004″ (.102 mm)

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