Effective heat transfer mechanisms in PCBs are crucial to enhancing their performance and reliability. They also aid in lowering noise levels and overall product costs. To provide a systematic thermal route from the chip (IC) to the heatsink, plated through-hole vias are implemented. These vertically drilled vias, known as thermal vias, typically connect all the layers of a board. Understanding the thermal resistance of these through-holes will help in determining their heat dissipation capacities.
Sierra Circuits’ Via Thermal Resistance Calculator computes the required number of thermal vias you can include in a via arrangement connecting a thermal pad. This calculator also optimizes the drill diameter and spacing between two vias for a given number of thermal vias.
The input parameters for this tool are:
The output parameters:
First, choose the desired via pattern from the drop-down.
Now, input all the default parameters along with via to via spacing and the number of thermal vias and hit calculate beside the drill diameter field. The tool will display the optimum drill diameter.
Enter the values of all the default input parameters (length of the thermal pad, width of the thermal pad, thermal conductivity of copper, thermal conductivity of the filler, via height, and plating thickness), drill diameter, and the number of thermal vias. Click on calculate adjacent to the via to via spacing section. The suitable spacing values for your thermal vias will be displayed.
Here, you need to enter the values of all the default input parameters (length of the thermal pad, width of the thermal pad, thermal conductivity of copper, thermal conductivity of the filler, via height, and plating thickness), via to via spacing, and drill diameter. Next, hit calculate alongside the number of thermal vias section.
Sierra Circuits’ Via Thermal Resistance Calculator is an advanced PCB design tool that expedites the process of designing thermal vias. Using this application, you can quickly identify the thermal resistance of a single or a combination of vias. You can also calculate the accurate drill diameter, via to via spacing, and the thermal vias that can go into a thermal pad.
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