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Specs for Military Grade PCBs

The Pitch

An experienced mil-spec PCB manufacturer for defense and aerospace
Efficient designs leading to fast-track production
IPC Class 3 certified and ITAR compliant

The Parameters

Next day for standard FR-4 or double-sided PCBs
2–4 days for 4-layer to 8-layer PCBs
5 days for 10-layer PCBs and above
5–10 days for HDI, rigid-flex, flex, and metal core PCBs

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Capabilities

Max Layer Count	30	24	+\- 16
Min Board Thickness	.01″ (.254 mm)	.01″ (.254 mm)
Max Board Thickness	.25″ (6.35 mm)	.25″ (6.35 mm)
Min Core Thickness	.002″ (.051 mm)	.002″ (.051 mm)	.001″ (.025 mm)
Min Dielectric Thickness	.002″ (.051 mm)	.002″ (.051 mm)	.001″ (.025 mm)
Min Starting Copper Foil Thickness/Weight	9 micron (0.25 oz) (.009 mm (7.4 ml))	9 microns (0.25 oz) (.009 mm (7.4 ml))	9 microns (0.25 oz) (.009 mm (7.4 ml))
Max Finished Copper Thickness/Weight (O/L)	6 oz (177.4 ml)	2 oz (59 ml)	2 oz (59 ml)
Max Finished Copper Thickness/Weight (I/L)	6 oz (177.4 ml)	2 oz (59 ml)	2 oz (59 ml)
Min Panel Size	12″ x 18″ (30 x 46 cm)	12″ x 18″ (30 x 46 cm)	12″ x 18″ (30 x 46 cm)
Max Panel Size	21″ x 29″ (53 x 74 cm)	21″ x 29″ (53 x 74 cm)	12″ x 18″ (30 x 46 cm)
Smallest Mech Drill Diameter	.0059″ (.150 mm)	.005″ (.127 mm)	.0059″ (.150 mm)
Smallest Laser Drill Diameter	.004″ (.102 mm)	.004″ (.102 mm)	.003″ (.076 mm)
Max Through-Hole Aspect Ratio	10:1	10:1	10:1
Max Blind Via Aspect Ratio	.75:1	.75:1	.75:1
Min Drill-to-Copper Clearance	.006″ (.152 mm)	.005″ (.127 mm)	.008″ (.203 mm)
Min Trace and Space Width	.003″ (.076 mm)	.003″ (.076 mm)	.0035″ (.089 mm)
Min Pad Size for Test	.005″ (.127 mm)	.004″ (.102 mm)	.005″ (.127 mm)
Process Pad Diameter	D + .012″ (.305 mm) (1-mil (.025 mm) annular ring)	D + .010″ (.254 mm) (1-mil (.025 mm) annular ring)	D + .014″ (.356 mm) (1-mil (.025 mm) annular ring)
Stacked Vias	Yes	Yes	No
Min Wire Bond Pad Size	> .004″ (.102 mm)	> .003″ (.076 mm)	.005″ (.127 mm)
Controlled Impedance Tolerance	10%	10%	10%
Solder Mask Registration	.002″ (.051 mm)	Within .001″ (.025 mm)	Within .002″ (.051 mm)
Solder Mask Feature Tolerance	.001″ (.025 mm)	.001″ (.025 mm)	.001″ (.025 mm)
Solder Mask Min Dam Size	.004″ (.102 mm)	.004″ (.102 mm) (SMT) .0035″ (.089 mm) (BGA)	.005″ (.127 mm)
Min Diameter Rout Cutter	.024″ (.610 mm)	.024″ (.610 mm)	.024″ (.610 mm)
Mech Routed Part Size Tolerance	+/- 5	+/- 5	+/- 5
Laser Hole Location Tolerance	.001″ (.025 mm)	.001″ (.025 mm)	.001″ (.025 mm)
Laser Routed Part Size Tolerance – Can only be done with panels <.032″ thick	.001″ (.025 mm)	.001″ (.025 mm)	.001″ (.025 mm)
Bow and Twist Tolerance	Per IPC Spec	7%	7% along rigid area
Thickness Tolerance	10%	10%	10%
Sequential Laminations	3	4	3
Conductive Filled Vias	Yes	Yes	No
Non-Conductive Filled Vias	Yes	Yes	Yes

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Manufacturing Equipment at Sierra Circuits

Our 70,000 sqft state-of-the-art campus in the heart of Silicon Valley contains the most advanced equipment required for the manufacture and assembly of your PCBs. Whether you’re looking for standard quick turn PCBs or boards with the tightest tolerances, made from exotic metals, there’s a reason Sierra Circuits leads the industry in quality and performance.

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PCBs manufactured and assembled in the United States

Turn-times as fast as 1 day.

Sierra Circuits can manufacture your PCB and have it expedited to you within 24 hours.

Full turnkey boards, with assembly and components in as fast as 5 days.

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