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Microelectronics PCB Specs

The Pitch

  • Extremely precise design, manufacturing, and prototyping
  • Efficient designs leading to faster time-to-market
  • Special stack-up help / NPI review

The Parameters

  • Blind vias, buried vias, or microvia techniques
  • Built-up laminations and high-signal performance considerations
  • Laser direct imaging
  • Fine lines and via-in-pad technology
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PCB Manufacturing
PCB Assembly
PCB Design and Layout
PCB Basics
Vias, Drilling & Throughplating
PCB Fabrication
PCB Ordering
PCB Attributes
Min Layer Count 1
Max Layer Count 30
Min Board Thickness .005″ (.127 mm)
Max Board Thickness .250″ (6.35 mm)
Min Core Thickness .002″ (.051 mm)
Min Dielectric .002″ (.051 mm)
Min Starting Copper Foil Weight 3 micron (.003 mm)
Max Finished Copper Thickness (O/L) .0015″ (.038 mm)
Max Finished Copper Thickness (I/L) .001″ (.025 mm)
Min Panel Size 12″ x 18″ (30 x 46 cm)
Max Panel Size 12″ x 18″ (30 x 46 cm)
Smallest Mechanical Drill Diameter .005″ (.127 mm)
Smallest Laser Drill Diameter .0025″ (.064 mm)
Min Finished Hole Size .002″ (.051 mm)
Max Through Hole Aspect Ratio > 10:1
Max Blind Via Aspect Ratio .8:1
Blind Via Finished Hole Size Plated shut
Buried Via Finished Hole Size .002″ (.051 mm)
Min Trace and Space .0015″ (.038 mm)
Min Pad Size for Test .003″ (.076 mm)
Process Pad Diameter D + .004″ (.102 mm)
Stacked Vias Yes
Min Wire Bond Pad Size .0025″ (.064 mm)
Controlled Impedance Tolerance 5%
Solder Mask Registration .001″ (.025 mm)
Solder Mask Feature Tolerance .0005″ (.013 mm)
Solder Mask Min Dam Size .003″ (.076 mm)
Min Diameter Route Cutter Available .021″ (.533 mm)
Routed Part Size Tolerance .002″ (.051 mm)
Laser Hole Location Tolerance .0005″ (.013 mm)
Laser Routed Part Size Tolerance – Can only be done with panels < .032” thick .001″ (.025 mm)
Bow and Twist Tolerance Per IPC Spec
Thickness Tolerance 5%
Sequential Laminations > 5 lam cycles
Buried Vias Yes
Blind Vias Yes
Conductive Filled Vias Yes – Cu plate shut
Non Conductive Filled Vias Yes
Surface Finishes
HASL (Vertical or Horizontal) No
Lead Free HASL No
OSP (Shikoku F2) Yes
OSP (Entek) Yes
ENIG (Electroless Nickel/Immersion Gold) Yes
Immersion Silver No
Electrolytic Soft Gold Yes
Electrolytic Hard Gold Yes
Selective Gold Yes
Solder Mask Finishes
Semi – Glossy Yes
Glossy Yes
Matte Yes
Solder Mask Colors
Green Yes
Black Yes
Red Yes
Blue Yes
Yellow No
White No
Clear Yes
Bright White No
Purple No
All Colors Yes
Routed Array Yes
V Score, Edge to Copper 0.007″ (.178 mm)
V Score Angles 35°, 45°, 60°
Countersink Yes
Counterbore Yes
Bevel Yes
Milling +/- .001” (.025 mm)
Edge Castellation Yes
Edge Plating Yes
Heatsinks No
Electrical Test
10 Volt Yes
40 Volt (Burn-In Boards) Yes
250 Volt Yes
500 Volt Yes
Hi Pot Yes
Laminate Materials
Very Thin Film Yes
Arlon 85NT No
Bergquist No
Hybrid Constructions Yes
Isola FR406 Yes
Isola FR408 HR Yes
Isola P95 Yes
Isola P96 Yes
Iteq IT180 Yes
Panasonic R1766 Yes
Panasonic R1755 No
Panasonic Megtron No
Nelco N4000-13 Yes
Nelco N4000-29 No
Nelco BT N5000 Yes
Nelco N7000-2 Yes
No Flow Prepreg Yes
Isola 370HR Yes
Polyclad Getek Yes
PSA Bond Film Yes
Rogers 3000 Series No
Rogers R4000 Series No
Rogers 5000 Series No
Rogers 6000 Series No
Rogers TMM No
Available Reports
Microsection Yes
Solderability Yes
X-Ray Fluorescence Yes
Ionic Contamination Yes
Time Domain Reflectometry Test (TDR) Yes
Certificate of Compliance Yes
94VO No
PCB Classifications Mil-Spec
MIL-PRF-55110 No
MIL-PRF-31032/1 No
MIL-PRF-31032/2 No
IPC 6012, Class 1, 2 and 3 Yes
ISO 9001:2015 Yes
ISO 13485:2016 Yes
PCB Manufacturing
PCB Assembly
PCB Design and Layout
PCB Basics
Vias, Drilling & Throughplating
PCB Fabrication
PCB Ordering

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