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Flex PCB Specs

The Pitch

Get low-to-high volume flex, rigid-flex and HDI Flex PCBs manufactured with industry leading quick turnaround times.

Freedom of design
Reduced space and weight
Increased reliability and durability.
Improved heat dissipation and airflow
Use in harsh environment

The Parameters

Three types of flex designs: flex, rigid-flex and HDI flex
Special stack-up help / NPI review
Up to 12 layers for flex and 16 layers for rigid-flex
The most effective PCB layout for compact devices
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PCB Attributes

Min Layer Count	1	1
Max Layer Count	12	≥ 16
Min Core thickness	.001″ (.025 mm)	.002″ (.051 mm)
Max Finished Copper Weight (I/L)	2 oz (59 ml)	3 oz (89 ml)
Max Finished Copper thickness (O/L)	12 micron (.012 mm)	9 micron (.009 mm) (only for O/L)
Max Panel Size	12×18	12×18
Smallest Mechanical Drill Diameter	.0079″ (.201 mm)	.0071″ (.180 mm)
Smallest Laser Drill Diameter	No	.005″ (.127 mm)
Min Finished Hole Size	.006″ (.152 mm)	.006″ (.152 mm)
Max through Hole Aspect Ratio	10:1	10:1
Max Blind Via Aspect Ratio	.75:1	.75:1
Min Trace and Space	≤ .0035″ (.089 mm)	≤ .0030″ (.076 mm) (rigid)
Min Pad Size for Test	.016″ (.406 mm)	.005” (.127 mm) (rigid)
Process Pad Diameter	D + .014″ (.356 mm) (1-mil (.025 mm) annular ring)	D + .014″ (.356 mm) (1-mil (.025 mm) annular ring)
Stacked Vias	No	No
Min Wire Bond Pad Size	> .006″ (.152 mm)	> .006″ (.152 mm)
Controlled Impedance Tolerance	10%	5%
Solder Mask Registration	Within .002″ (.051 mm)	Within .002″ (.051 mm)
Solder Mask Feature Tolerance	.001″ (.025 mm)	.001″ (.025 mm)
Solder Mask Min Dam Size	.004″ (.102 mm)	.001″ (.025 mm)
Min Diameter Route Cutter Available	.019″ (.483 mm)	.024″ (.610 mm)
Mechanical Routed Part Size Tolerance	.003″ (.076 mm)	.010″ (.254 mm)
Bow and Twist Tolerance	N/A	As per spec
Thickness Tolerance	+/- .002″ (.051 mm)	10%
Sequential Laminations	n/a	2
Buried Vias	Yes	Yes
Blind Vias	Yes	Yes
Conductive Filled Vias	No	Yes
Non Conductive Filled Vias	No	Yes

Surface Finishes

HASL (Vertical or Horizontal)	Yes (not recommended)	Yes
Lead Free HASL	Yes (not recommended)	Yes
OSP (Shikoku F2)	Yes (not recommended)	Yes
OSP (Entek)	Yes (not recommended)	Yes
ENIG (Electroless Nickel/Immersion Gold)	Yes (most common)	Yes
Immersion Silver	Yes (not recommended)	Yes
Immersion White Tin	No	No
Tin Nickel	No	No
Electrolytic Soft Gold	Yes	Yes
Electrolytic Hard Gold	Yes	Yes
Selective Gold	Yes	Yes

Solder Mask Colors

Amber	Yes	Yes
Green	Yes	Yes
Black	No	Yes
Red	No	Yes
Blue	No	Yes
Yellow	No	Yes
White	No	Yes
Clear	No	Yes
Bright White	No	Yes
Purple	No	Yes

Legend

White	Yes	Yes

Fab

Routed Array	Yes	Yes
V Score, Edge to Copper	.002″ (.051 mm)	.01″ (.254 mm)
V Score Angles	No	Yes
Countersink	Yes	Yes
Counterbore	Yes	Yes
Bevel	Yes	Yes
Milling	Yes	Yes
Edge Castellation	Yes	Yes
Edge Plating	Yes	Yes
Heatsinks	No	No

Electrical Test

10 Volt	Yes	Yes
40 Volt (Burn-In Boards)	Yes	Yes
250 Volt	Yes	Yes
500 Volt	Yes	Yes

Flexible Poyimide	Yes	Yes
Arlon 85NT	No	No
Bergquist	No	No
Hybrid Constructions	Yes	Yes
Isola FR406	Yes	Yes
Isola FR408 HR	Yes	Yes
Isola P95	Yes	Yes
Isola P96	Yes	Yes
Iteq IT180	Yes	Yes
Panasonic R1766	Yes	Yes
Panasonic R1755	Yes	Yes
Panasonic Megtron	Yes	Yes
Nelco N4000-13	Yes	Yes
Nelco N4000-29	Yes	Yes
Nelco BT N5000	Yes	Yes
Nelco N7000-2	Yes	Yes
No Flow Prepreg	Yes	Yes
Isola 370HR	v	Yes
Polyclad Getek	No	No
PSA Bond Film	Yes	Yes
Rogers 3000 Series	No	No
Rogers R4000 Series	No	No
Rogers 5000 Series	No	No
Rogers 6000 Series	No	No
Rogers TMM	No	No

Available Reports

Microsection	Yes	Yes
Solderability	Yes	Yes
X-Ray Fluorescence	Yes	Yes
Ionic Contamination	Yes	Yes
Time Domain Reflectometry Test (TDR)	Yes	Yes
FAI	Yes	Yes
Certificate of Compliance	Yes	Yes

94VO	Yes	Yes

PCB Classifications Mil-Spec

MIL-PRF-55110	No	No
MIL-PRF-31032/1	No	No
MIL-PRF-31032/2	No	No
IPC 6012, Class 1, 2 and 3	Yes	Yes
ISO 9001:2015	Yes	Yes
ISO 13485:2016	Yes	Yes

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Turn-times as fast as 1 day.

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Full turnkey boards, with assembly and components in as fast as 5 days.

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