Microelectronics PCB Capabilities

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You may be surprised how cost effective microelectronics PCBs are at scale.

Sierra Circuits engineers can help you efficiently produce your microelectronics PCBs in the United States. As a quick example, one way our engineers can help is by planning your stack-up early in the process—reducing your layer count by reducing your trace width.

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Product Promise

Microelectronics design services, capabilities, and testing. Sierra Circuits manufactures your micro PCBs with full intellectual property protection.

Extremely precise, highly technical:

Blind vias, buried vias, or microvia techniques
Built-up laminations and high-signal performance considerations
Laser direct imaging
Fine lines and via-in-pad technology

Attributes of microelectronics PCBs
PCB Attribute	Sierra Circuits capability
Min Layer Count	1
Max Layer Count	30
Min Board Thickness	.005″ (.127 mm)
Max Board Thickness	.250″ (6.35 mm)
Min Core Thickness	.002″ (.051 mm)
Min Dielectric	.002″ (.051 mm)
Min Starting Copper Foil Weight	3 micron (.003 mm)
Max Finished Copper Thickness (O/L)	.0015″ (.038 mm)
Max Finished Copper Thickness (I/L)	.001″ (.025 mm)
Min Panel Size	12″ x 18″ (30 x 46 cm)
Max Panel Size	12″ x 18″ (30 x 46 cm)
Smallest Mechanical Drill Diameter	.005″ (.127 mm)
Smallest Laser Drill Diameter	.0025″ (.064 mm)
Min Finished Hole Size	.002″ (.051 mm)
Max Through Hole Aspect Ratio	> 10:1
Max Blind Via Aspect Ratio	.8:1
Blind Via Finished Hole Size	Plated shut
Buried Via Finished Hole Size	.002″ (.051 mm)
Min Trace and Space	.0015″ (.038 mm)
Min Pad Size for Test	.003″ (.076 mm)
Process Pad Diameter	D + .004″ (.102 mm)
Stacked Vias	Yes
Min Wire Bond Pad Size	.0025″ (.064 mm)
Controlled Impedance Tolerance	5%
Solder Mask Registration	.001″ (.025 mm)
Solder Mask Feature Tolerance	.0005″ (.013 mm)
Solder Mask Min Dam Size	.003″ (.076 mm)
Min Diameter Route Cutter Available	.021″ (.533 mm)
Routed Part Size Tolerance	.002″ (.051 mm)
Laser Hole Location Tolerance	.0005″ (.013 mm)
Laser Routed Part Size Tolerance – Can only be done with panels < .032” thick	.001″ (.025 mm)
Bow and Twist Tolerance	Per IPC spec
Thickness Tolerance	5%
Sequential Laminations	> 5 lam cycles
Buried Vias	Yes
Blind Vias	Yes
Conductive Filled Vias	Yes – Cu plate shut
Non Conductive Filled Vias	Yes

Surface finishes for microelectronics PCBs
Surface Finish Type	Sierra Circuits capability
HASL (Vertical or Horizontal)	No
Lead Free HASL	No
OSP (Shikoku F2)	Yes
OSP (Entek)	Yes
ENIG (Electroless Nickel/Immersion Gold)	Yes
Immersion Silver	No
Electrolytic Soft Gold	Yes
Electrolytic Hard Gold	Yes
Selective Gold	Yes

Solder mask finishes for microelectronics PCBs
Mask Finish Type	Sierra Circuits capability
Semi – Glossy	Yes
Glossy	Yes
Matte	Yes

Solder mask colors for microelectronics PCBs
Mask Color	Sierra Circuits capability
Green	Yes
Black	Yes
Red	Yes
Blue	Yes
Yellow	No
White	No
Clear	Yes
Bright White	No
Purple	No

Legend colors for microelectronics PCBs
Legend Color	Sierra Circuits capability
All Colors	Yes

Fabrication techniques for microelectronics PCBs
Fabrication Technique	Sierra Circuits capability
Routed Array	Yes
V Score, Edge to Copper	0.007″ (.178 mm)
V Score Angles	35°, 45°, 60°
Countersink	Yes
Counterbore	Yes
Bevel	Yes
Milling	+/- .001” (.025 mm)
Edge Castellation	Yes
Edge Plating	Yes
Heatsinks	No

Electrical testing for microelectronics PCBs
Test Type	Sierra Circuits capability
10 Volt	Yes
40 Volt (Burn-In Boards)	Yes
250 Volt	Yes
500 Volt	Yes
Hi Pot	Yes

Laminate materials for microelectronics PCBs
Material Type	Sierra Circuits capability
Very Thin Film	Yes
Arlon 85NT	No
Bergquist	No
Hybrid Constructions	Yes
Isola FR406	Yes
Isola FR408 HR	Yes
Isola P95	Yes
Isola P96	Yes
Iteq IT180	Yes
Panasonic R1766	Yes
Panasonic R1755	No
Panasonic Megtron	No
Nelco N4000-13	Yes
Nelco N4000-29	No
Nelco BT N5000	Yes
Nelco N7000-2	Yes
No Flow Prepreg	Yes
Isola 370HR	Yes
Polyclad Getek	Yes
PSA Bond Film	Yes
Rogers 3000 Series	No
Rogers R4000 Series	No
Rogers 5000 Series	No
Rogers 6000 Series	No
Rogers TMM	No

Testing reports for microelectronics PCBs
Available Reports	Sierra Circuits capability
Microsection	Yes
Solderability	Yes
X-Ray Fluorescence	Yes
Ionic Contamination	Yes
Time Domain Reflectometry Test (TDR)	Yes
FAI	Yes
Certificate of Compliance	Yes

UL certification for microelectronics PCBs
Certification	Sierra Circuits capability
94VO	No

Classifications for microelectronics mil-spec PCBs
Classification	Sierra Circuits capability
MIL-PRF-55110	No
MIL-PRF-31032/1	No
MIL-PRF-31032/2	No
IPC 6012, Class 1, 2 and 3	Yes
ISO 9001:2015	Yes
ISO 13485:2016	Yes

Trusted by innovators

Made in America. Engineers at the world’s most innovative companies choose Sierra Circuits for the highest quality microelectronics PCB design and manufacturing.

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Sierra Circuits engineers and technicians have the experience to bring your microelectronics to life.

Whether you’re a medical device designer on a tight deadline or a DoD contractor looking to satisfy ITAR regulations, Sierra Circuits manufactures and assembles the most reliable microelectronics PCBs in the United States.

Ideal for:

Medical miniaturization for devices operating directly with the human body
DoD electronics for mission critical functions
Highly advanced and sophisticated small form factor products like IoT devices, wearables, and similar portable devices

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Let us introduce you to one of the most innovative communities of engineers and designers in the world.

We can help you plan your project from design to assembled board.

Manufacturing Equipment at Sierra Circuits

Our 70,000 sqft state-of-the-art campus in the heart of Silicon Valley contains the most advanced equipment required for the manufacture and assembly of your PCBs. Whether you’re looking for standard quick turn PCBs or boards with the tightest tolerances, made from exotic metals, there’s a reason Sierra Circuits leads the industry in quality and performance.

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