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Milana Yogendrappa
Sierra Circuits
Technical Content Writer
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Features of IPC 7351 Standards to Design a PCB Component Footprint
A PCB reflects every component footprint on it. This land pattern comes with a solder mask opening so that the ... more »
PCB Assembly
Transient Analysis for Non-Sinusoidal Signals
Transient analysis is one of the critical aspects to ensure signal integrity in your PCB design. The main goal is ... more »
PCB Design
Try the KiCad PCB Plugin for an Instant Quote
Sierra Circuits has developed a KiCad PCB plugin that can be integrated into the design tool. This plugin enables designers ... more »
KiCad Tutorials
How to Determine the Impedance of a Circuit
Impedance impacts how signals propagate through the board, how power is exchanged between components, and how signals leak into undesired ... more »
PCB Design
Best EMI and RF Shielding Methods for Flex PCBs
Flexible PCBs, like any other electrical interconnect, are susceptible to electromagnetic (EM) and radio frequency (RF) interference. The negative consequences ... more »
EMI and EMC
Air Gap Construction Method in Rigid-Flex PCBs
Air gap construction method in rigid-flex PCB manufacturing was introduced by the IPC to overcome the mechanical and electrical reliability ... more »
Flex PCBs
5 Factors That Delay Flex PCB Quick Turn Delivery
The production of flex circuit boards is rising at a rapid rate in response to the increased demand. Quick turn ... more »
Flex PCBs
What Are the Cost Drivers of Flex PCBs?
Cost optimization is one of the major objectives when designing a PCB. To achieve that, every designer should know the ... more »
Flex PCBs
How to Mitigate Outgassing Effects in PCBs
PCB outgassing or off-gassing is a defect that occurs when air is trapped inside a circuit board during production. The ... more »
PCB Assembly
Why FR4 Material is Commonly used in PCB Fabrication?
FR4 is the most common grade dielectric material that is used in the fabrication of circuit boards. This material is ... more »
PCB Manufacturing
How to Build a Flex Stack-Up with Controlled Impedance
Impedance is the measurement of the restriction imposed by a circuit on the current flow. It is similar to resistance, ... more »
Controlled Impedance
How to Build a Multilayer PCB Stack-up
A multilayer PCB has more than two layers in its stack-up. Stack-up is one of the most important aspects of ... more »
PCB Manufacturing
What’s the Meaning of a Schematic Diagram?
A schematic diagram is a fundamental two-dimensional circuit representation showing the functionality and connectivity between different electrical components. It is ... more »
PCB Design
Flex PCB Design Guidelines for Manufacturing
In this webinar, we discuss flex PCB design guidelines for manufacturing. The flex PCBs offer many advantages for both the ... more »
Flex PCBs
PCB Material Selection: Electrical and Manufacturing Considerations
When it comes to PCB material selection, making the right choice for your design is important because materials can impact ... more »
PCB Design
How to Design a PCB Layout
The design process of a PCB will essentially begin by creating a schematic. This schematic is then developed into a ... more »
PCB Design
Why Are Flex PCBs Used in Satellite Applications?
The development of flex PCBs for satellite application has gathered significant interest among several space agencies. Numerous benefits of flex ... more »
Defense & Space
A Guide to PCB Stiffeners for Flex and Rigid-Flex
In the PCB assembly, stiffeners are a typical necessity in numerous flex circuit designs. Flexible circuit boards are one of ... more »
Flex PCBs
What is CAM or Computer-Aided Manufacturing?
Computer-Aided Manufacturing is the use of software and computer-controlled machinery to automate a manufacturing process.
PCB Manufacturing
How to Achieve a Robust PCB Design Workflow for Signal Integrity?
Signal Integrity (SI) signifies the signal’s ability to propagate along PCB traces without distortion. Signal integrity is about the quality ... more »
PCB Design
PCB Stack-Up: Plan, Design, Manufacture and Repeat
Often ignored, it is important to understand the difference between anHDI stack-up and a standard stack-up. The primary reason being ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards