It’s the time of the year where the gadget geeks get all anxious. The company which tops the search results on google over a fruit, Apple, is back with the much-anticipated new models. The all-new iPhone 11 , iPhone 11 Pro, and iPhone 11 Pro max are here. Get ready to burry your current handsets cause the brand-new iPhone will make it look like junk.
The cross-section or micro-section analysis is a destructive analysis that measures the quality of the manufactured board. It’s basically an interconnection defect analysis process that detects and verifies what went wrong inside the PCB.
As the electronic devices are shrinking in size, the pitch size is drastically decreasing. The components are getting packed on a PCB like the grains in an ear of corn. All these things have led to one of the most efficient component package, the Ball Grid Array (BGA). Continue reading “Ball Grid Array (BGA): Features, Soldering Technique, and X-Ray Inspection”
The sound vroom… has been turning heads since the time the automobiles hit the streets. The integration of electronics has catapulted the growth of the automotive industry substantially. Buyers look into the luxury features along with the performance of a car or any other vehicle. All these features including the performance of an internal combustion engine are controlled by electronic modules.
The digital word is getting bigger hour by hour whereas the hardware associated with it is getting drastically smaller. Contrary to the popular belief, smaller the better is the way to go! Continue reading “Behind the Scenes with HDI PCB and its Applications”
Drilling is the most expensive and time-consuming process in PCB manufacturing. The PCB drilling process must be carefully implemented since even a small error can lead to a great loss. The drilling process is considered the most critical and bottleneck of printed circuit board manufacturing. A PCB design engineer must always look into the board manufacturers’ capabilities before placing an order.