Speak to an Account Manager
+1 (800) 763-7503
Related Categories — IPC » PCB Design
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance between the […]
Case Studies
How to Design and Build a Hybrid PCB Stack-Up
A hybrid stack-up construction enhances your PCB’s performance and cost-effectiveness by combining different materials or technologies. It helps ... more »
PCB Manufacturing
Case Study: Designing a High-Current PCB with Voltage Doublers
PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing ... more »
Case Studies
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance ... more »
Case Studies
How to Design and Build a Hybrid PCB Stack-Up
A hybrid stack-up construction enhances your PCB’s performance and cost-effectiveness by combining different materials or technologies. It helps ... more »
PCB Manufacturing
Case Study: Designing a High-Current PCB with Voltage Doublers
PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing ... more »
Case Studies
How Via Impedance Impacts Signal Integrity in PCBs
Just like trace impedance, via impedance is also important in maintaining the signal integrity of your PCB design. ... more »
Signal Integrity
Best PCB Grounding Techniques for High-Power and HDI Designs
Incorporating proper PCB grounding techniques, such as dedicated ground planes, ground vias, and galvanic isolation, is critical in building reliable and ... more »
PCB Design
Aerospace PCB Design Tips for Efficient Thermal Management
Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »
PCB Design
How Via Stitching Facilitates High-Current PCB Designs
Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »
PCB Design
Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards