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Case study: Designing a High-Current PCB with Voltage Doublers

PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing issues. While […]

Case Studies

14 Aviation and Aerospace PCB Design Rules for High Reliability

When you’re designing aerospace and aviation PCBs, you need to consider structural strength, corrosion resistance, heat dissipation, and ... more »

Defense & Space

Best PCB Grounding Techniques for High-Power and HDI Designs

Incorporating proper PCB grounding techniques such as dedicated ground planes, ground vias, and galvanic isolation is critical in ... more »

PCB Design

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Case study: Designing a High-Current PCB with Voltage Doublers

PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing ... more »

Case Studies

14 Aviation and Aerospace PCB Design Rules for High Reliability

When you’re designing aerospace and aviation PCBs, you need to consider structural strength, corrosion resistance, heat dissipation, and ... more »

Defense & Space

Best PCB Grounding Techniques for High-Power and HDI Designs

Incorporating proper PCB grounding techniques such as dedicated ground planes, ground vias, and galvanic isolation is critical in ... more »

PCB Design

Aerospace PCB Design Tips for Efficient Thermal Management

Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »

PCB Assembly

How Via Stitching Facilitates High-Current PCB Designs

Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »

PCB Design

S-parameters Measurement Using a Vector Network Analyzer

Designing a board for operating frequencies higher than a few hundred MHz becomes challenging as it is difficult ... more »

PCB Design

Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias

Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »

Case Studies

IPC Class 2 VS Class 3: The Different Design Rules

As circuit board manufacturers, designers often ask us about the difference between IPC Class 2 and Class 3. ... more »

IPC

Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs

BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »

Case Studies

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