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Related Categories — PCB Assembly » PCB Design
Case study: Designing a High-Current PCB with Voltage Doublers
PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing issues. While […]
Case Studies
14 Aviation and Aerospace PCB Design Rules for High Reliability
When you’re designing aerospace and aviation PCBs, you need to consider structural strength, corrosion resistance, heat dissipation, and ... more »
Defense & Space
Best PCB Grounding Techniques for High-Power and HDI Designs
Incorporating proper PCB grounding techniques such as dedicated ground planes, ground vias, and galvanic isolation is critical in ... more »
PCB Design
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Case study: Designing a High-Current PCB with Voltage Doublers
PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing ... more »
Case Studies
14 Aviation and Aerospace PCB Design Rules for High Reliability
When you’re designing aerospace and aviation PCBs, you need to consider structural strength, corrosion resistance, heat dissipation, and ... more »
Defense & Space
Best PCB Grounding Techniques for High-Power and HDI Designs
Incorporating proper PCB grounding techniques such as dedicated ground planes, ground vias, and galvanic isolation is critical in ... more »
PCB Design
Aerospace PCB Design Tips for Efficient Thermal Management
Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »
PCB Assembly
How Via Stitching Facilitates High-Current PCB Designs
Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »
PCB Design
S-parameters Measurement Using a Vector Network Analyzer
Designing a board for operating frequencies higher than a few hundred MHz becomes challenging as it is difficult ... more »
PCB Design
Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
IPC Class 2 VS Class 3: The Different Design Rules
As circuit board manufacturers, designers often ask us about the difference between IPC Class 2 and Class 3. ... more »
IPC
Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
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