Skip to main content

Related Categories  —  HDI / Blind & Buried Vias  »  PCB Design  »  PCB Experts

Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias

Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with microvias positioned […]

Case Studies

How Sequential Lamination is Performed to Manufacture HDI PCBs

Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »

HDI / Blind & Buried Vias

Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs

BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »

Case Studies

PCBs manufactured and assembled in the United States

Ready to experience the highest quality PCBs?

Sierra Circuits PCB experts are on call 24 hours a day, 7 days a week.

Knowledge Base

Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias

Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »

Case Studies

How Sequential Lamination is Performed to Manufacture HDI PCBs

Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »

HDI / Blind & Buried Vias

Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs

BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »

Case Studies

How System-in-Package (SiP) Facilitates HDI PCB Designs

We ran into Vern Solberg of Solberg Technical Consulting at PCB West 2022 and discussed the features of ... more »

HDI / Blind & Buried Vias

HDI Standard Board Tools for a Better PCB design

Unlike traditional PCBs, HDI boards can obtain interconnections through blind vias, buried vias, and microvias, instead of just ... more »

HDI / Blind & Buried Vias

Choosing Smaller Footprints for HDI Design

The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller ... more »

HDI / Blind & Buried Vias

Key Aspects of DFM for HDI PCBs

Design for manufacturability (DFM) for HDI PCBs refers to designing layouts that reduce the errors associated with fabrication ... more »

Defense & Space

Impedance Matching in HDI PCB Design

Impedance matching is the way of configuring the input impedance of a load or the output impedance of ... more »

Controlled Impedance

How to Avoid Crosstalk in HDI Substrate?

Miniaturization of the copper features in electronic circuits results from placing interconnections closely with a high packing density. ... more »

HDI / Blind & Buried Vias

Talk to a Sierra Circuits PCB Expert today

24 hours a day, 7 days a week.

Call us: +1 (800) 763-7503
Email us: through our Customer Care form