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Related Categories  —  HDI / Blind & Buried Vias  »  PCB Design  »  Signal Integrity

Top 5 HDI PCB Routing Challenges and Ways to Mitigate Them

HDI designs pose complex routing challenges due to their tight spacing between components and traces. The use of DRC settings […]

HDI / Blind & Buried Vias

How to Design Reliable Microvias in Your PCBs

Microvia failure occurs due to the thermal stresses that arise during the PCB assembly process. These stresses can ... more »

HDI / Blind & Buried Vias

High-Speed and HDI PCB Design Strategies by Syed Ubaid Ali Warsi

Syed Ubaid Ali Warsi, the owner of Wavetroniks, provided his insights into high-speed and HDI PCB design strategies ... more »

HDI / Blind & Buried Vias

Top 5 HDI PCB Routing Challenges and Ways to Mitigate Them

HDI designs pose complex routing challenges due to their tight spacing between components and traces. The use of ... more »

HDI / Blind & Buried Vias

How to Design Reliable Microvias in Your PCBs

Microvia failure occurs due to the thermal stresses that arise during the PCB assembly process. These stresses can ... more »

HDI / Blind & Buried Vias

High-Speed and HDI PCB Design Strategies by Syed Ubaid Ali Warsi

Syed Ubaid Ali Warsi, the owner of Wavetroniks, provided his insights into high-speed and HDI PCB design strategies ... more »

HDI / Blind & Buried Vias

10 HDI PCB Design Tips to Maintain Signal Integrity

When it comes to designing HDI PCBs, a plethora of challenges await, including complex routing requirements, issues related ... more »

HDI / Blind & Buried Vias

Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias

Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »

Case Studies

How Sequential Lamination is Performed to Manufacture HDI PCBs

Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »

HDI / Blind & Buried Vias

Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs

BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »

Case Studies

How System-in-Package (SiP) Facilitates HDI PCB Designs

We ran into Vern Solberg of Solberg Technical Consulting at PCB West 2022 and discussed the features of ... more »

HDI / Blind & Buried Vias

HDI Standard Board Tools for a Better PCB design

Unlike traditional PCBs, HDI boards can obtain interconnections through blind vias, buried vias, and microvias, instead of just ... more »

HDI / Blind & Buried Vias

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