Speak to an Account Manager
+1 (800) 763-7503
Related Categories — HDI / Blind & Buried Vias » PCB Design » PCB Experts
Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with microvias positioned […]
Case Studies
How Sequential Lamination is Performed to Manufacture HDI PCBs
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
Ready to experience the highest quality PCBs?
Sierra Circuits PCB experts are on call 24 hours a day, 7 days a week.
Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
How Sequential Lamination is Performed to Manufacture HDI PCBs
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
How System-in-Package (SiP) Facilitates HDI PCB Designs
We ran into Vern Solberg of Solberg Technical Consulting at PCB West 2022 and discussed the features of ... more »
HDI / Blind & Buried Vias
HDI Standard Board Tools for a Better PCB design
Unlike traditional PCBs, HDI boards can obtain interconnections through blind vias, buried vias, and microvias, instead of just ... more »
HDI / Blind & Buried Vias
Choosing Smaller Footprints for HDI Design
The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller ... more »
HDI / Blind & Buried Vias
Key Aspects of DFM for HDI PCBs
Design for manufacturability (DFM) for HDI PCBs refers to designing layouts that reduce the errors associated with fabrication ... more »
Defense & Space
Impedance Matching in HDI PCB Design
Impedance matching is the way of configuring the input impedance of a load or the output impedance of ... more »
Controlled Impedance
How to Avoid Crosstalk in HDI Substrate?
Miniaturization of the copper features in electronic circuits results from placing interconnections closely with a high packing density. ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards