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Related Categories — Case Studies » HDI / Blind & Buried Vias » PCB Design » Via
How to Design Reliable Microvias in Your PCBs
Microvia failure occurs due to the thermal stresses that arise during the PCB assembly process. These stresses can have a […]
HDI / Blind & Buried Vias
High-Speed and HDI PCB Design Strategies by Syed Ubaid Ali Warsi
Syed Ubaid Ali Warsi, the owner of Wavetroniks, provided his insights into high-speed and HDI PCB design strategies ... more »
HDI / Blind & Buried Vias
10 HDI PCB Design Tips to Maintain Signal Integrity
When it comes to designing HDI PCBs, a plethora of challenges await, including complex routing requirements, issues related ... more »
HDI / Blind & Buried Vias
How to Design Reliable Microvias in Your PCBs
Microvia failure occurs due to the thermal stresses that arise during the PCB assembly process. These stresses can ... more »
HDI / Blind & Buried Vias
High-Speed and HDI PCB Design Strategies by Syed Ubaid Ali Warsi
Syed Ubaid Ali Warsi, the owner of Wavetroniks, provided his insights into high-speed and HDI PCB design strategies ... more »
HDI / Blind & Buried Vias
10 HDI PCB Design Tips to Maintain Signal Integrity
When it comes to designing HDI PCBs, a plethora of challenges await, including complex routing requirements, issues related ... more »
HDI / Blind & Buried Vias
Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
How Sequential Lamination is Performed to Manufacture HDI PCBs
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
How System-in-Package (SiP) Facilitates HDI PCB Designs
We ran into Vern Solberg of Solberg Technical Consulting at PCB West 2022 and discussed the features of ... more »
HDI / Blind & Buried Vias
HDI Standard Board Tools for a Better PCB design
Unlike traditional PCBs, HDI boards can obtain interconnections through blind vias, buried vias, and microvias, instead of just ... more »
HDI / Blind & Buried Vias
Choosing Smaller Footprints for HDI Design
The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
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- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
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