Air gap construction method in rigid-flex PCB manufacturing was introduced by the IPC to overcome the mechanical and electrical reliability issues in higher layer count rigid-flex designs. In this...
Effects of vibrations on PCBA causes fatigue and eventually fail some parts in space missions. These electronic devices should function precisely in harsh space environments and ensure high...
J-STD-001 is a standard issued by IPC for soldered electrical and electronic assemblies. The standard specifies material specifications, process requirements, and acceptability criteria. ...
Circuit board manufacturers have invested in advanced modeling software and testing devices to specify the controlled impedance requirements to fulfill the demand surge. Nowadays, more PCB designs...
The production of flex circuit boards is rising at a rapid rate in response to the increased demand. Quick turn flex PCBs are in high demand and are put into production as soon as they are tested....
Design for manufacturing (DFM) guidelines resolves potential issues that can occur during the manufacturing and assembly of circuit boards. DFM for flex and rigid-flex PCBs with SMT involves...
The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller footprints for HDI increases board functionality and component density. Therefore, while...