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Related Categories — Case Studies » HDI / Blind & Buried Vias » PCB Design
Aerospace PCB Design Tips for Efficient Thermal Management
Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with different temperatures […]
PCB Assembly
How Via Stitching Facilitates High-Current PCB Designs
Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »
PCB Design
S-parameters Measurement Using a Vector Network Analyzer
Designing a board for operating frequencies higher than a few hundred MHz becomes challenging as it is difficult ... more »
PCB Design
Aerospace PCB Design Tips for Efficient Thermal Management
Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »
PCB Assembly
How Via Stitching Facilitates High-Current PCB Designs
Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »
PCB Design
S-parameters Measurement Using a Vector Network Analyzer
Designing a board for operating frequencies higher than a few hundred MHz becomes challenging as it is difficult ... more »
PCB Design
Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
IPC Class 2 VS Class 3: The Different Design Rules
As circuit board manufacturers, designers often ask us about the difference between IPC Class 2 and Class 3. ... more »
IPC
How Sequential Lamination is Performed to Manufacture HDI PCBs
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
How to Optimize Your PCB Trace Using IPC-2152 Standard
IPC-2152 is the standard for determining the current capacity, temperature rise, and width of a trace in a ... more »
IPC
6 DFM Issues Designers Should Check Before PCB Manufacturing
Every PCB should be designed in such a way that the overall cost and chances of potential DFM ... more »
PCB Design
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
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- Blind & Buried Vias
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