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Related Categories  —  Case Studies  »  HDI / Blind & Buried Vias  »  PCB Design

Aerospace PCB Design Tips for Efficient Thermal Management

Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with different temperatures […]

PCB Assembly

How Via Stitching Facilitates High-Current PCB Designs

Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »

PCB Design

S-parameters Measurement Using a Vector Network Analyzer

Designing a board for operating frequencies higher than a few hundred MHz becomes challenging as it is difficult ... more »

PCB Design

Aerospace PCB Design Tips for Efficient Thermal Management

Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »

PCB Assembly

How Via Stitching Facilitates High-Current PCB Designs

Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »

PCB Design

S-parameters Measurement Using a Vector Network Analyzer

Designing a board for operating frequencies higher than a few hundred MHz becomes challenging as it is difficult ... more »

PCB Design

Case study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias

Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »

Case Studies

IPC Class 2 VS Class 3: The Different Design Rules

As circuit board manufacturers, designers often ask us about the difference between IPC Class 2 and Class 3. ... more »

IPC

How Sequential Lamination is Performed to Manufacture HDI PCBs

Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »

HDI / Blind & Buried Vias

Case Study: Designing an HDI Board with 0.4 and 0.65mm BGAs

BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »

Case Studies

How to Optimize Your PCB Trace Using IPC-2152 Standard

IPC-2152 is the standard for determining the current capacity, temperature rise, and width of a trace in a ... more »

IPC

6 DFM Issues Designers Should Check Before PCB Manufacturing

Every PCB should be designed in such a way that the overall cost and chances of potential DFM ... more »

PCB Design

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