Every day, PCB designs and components become smaller, faster – in other words, more complicated. It is now crucial to understand your critical nets and traces, impedances, and how the board impacts the performance of the signal. The time of simple interconnecting...
PCB land pattern defects should be treated with due attention since their design is very essential for the PCB manufacturing process. Land patterns and footprints in a PCB are often treated as similar terms. But they are not the same thing. Footprint gives an idea of...
Every PCB should be designed in such a way that the overall cost and chances of potential DFM issues can be minimized. It is done by adopting the optimized PCB design services for DFM checks. DFM is short for ‘Design for Manufacturability’. The designer/manufacturer...
In the production and assembly of electronic products, precise control of process parameters is essential. This is done by continuous monitoring and record of process parameters which includes thermal profiling. Thermal profiling involves controlling the temperatures...
Computer-Aided Manufacturing is the use of software and computer-controlled machinery to automate a manufacturing process.
Annular rings are one of the biggest concerns of PCB designers. You know that you may place your via right in the middle of the pad in the design files, but it just does not mean that you will 100 percent avoid tangencies, or even worse, breakouts. Let’s talk about...
As a circuit board manufacturer, designers often ask us about the difference between IPC Class 2 and Class 3. Class 1 does exist although we rarely produce boards that fall into this classification. Most of the times, even if the end-use of the product only requires...
PCB material selection is the first step in your PCB design process. Selecting the right PCB materials for your PCB design is very important as it can impact the overall performance of the PCB. Before selection begins, there are many factors to be considered. Make...
Multi-layered printed circuit board design requires a means to establish connections between various layers. This is done using vias ranging from through-hole vias to via-in-pad technology. While traces serve as horizontal connection elements, vias function as...