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Related Categories — PCB Assembly » PCB Design
S3 Test Eases Laminate Selection
For her MIT master’s thesis in engineering, Michelle Rybak investigated signal loss over frequency of six different PCB laminates, with special attention to distinguishing the resistive loss by the copper from the loss caused by dielectric absorption.
PCB Design
Steps To Your PCB Prototype (For Hardware Start-ups)
John Teel shares the steps to creating a successful prototype printed circuit board. This includes the design, fabrication ... more »
PCB Assembly
Tips Every PCB Designer Should Know
A board design that will be produced in quantity had better take into account how it can be ... more »
PCB Design
S3 Test Eases Laminate Selection
For her MIT master’s thesis in engineering, Michelle Rybak investigated signal loss over frequency of six different PCB ... more »
PCB Design
Steps To Your PCB Prototype (For Hardware Start-ups)
John Teel shares the steps to creating a successful prototype printed circuit board. This includes the design, fabrication ... more »
PCB Assembly
Tips Every PCB Designer Should Know
A board design that will be produced in quantity had better take into account how it can be ... more »
PCB Design
Consult Your Fabricator, Especially for Hybrid Designs
For manufacturers, there’s yet another consideration besides chip load and that’s drill hit count; the sharper the drill, ... more »
Flex PCBs
Making Sub 3/3 A Reality
Prudent PCB designers used to have good reasons for avoiding trace widths and spaces smaller than 3 mils ... more »
PCB Design
Learning about High-Speed PCB Design
Progress in electronics may not depend so much on semiconductor advances as it does on a transition to ... more »
High Speed
For Microwave PCBs, Solder Mask Design Affects Cost
Yield ultimately governs the cost of fabrication. If panels must be reprocessed because solder mask fails to adhere ... more »
PCB Design
Manufacturing Profitable HDI PCBs
Yield Drives Profit The first step toward designing a printed circuit board is to identify the least expensive ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards