Category: HDI / Blind & Buried Vias

Breakout a .4mm BGA

9 HDI Considerations for Manufacturability and Cost

At some level of circuit complexity, turning to an HDI architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design. In

Wearables, Medical Devices' Popularity Accelerating in Health Space
Smaller, more powerful devices have led the charge for HDI PCB designs.
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