HDI is a complex PCB technology that uses blind, buried and micro vias. HDI is characterized by its high density of components and routing interconnections, which can pain a pain to
One thing PCB designers will all agree on is that to breakout a BGA, you need precision and discipline. When you breakout a BGA, you basically apply a fanout solution.
At some level of circuit complexity, turning to an architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design. In this
Whether worn or implanted, medical devices have the potential to dramatically impact the health care sector as a whole. Both hospitals and startups are ramping up their efforts to take
Use these four tips to become a high density interconnect printed circuit board design master.
Choosing the right dielectric material for a PCB is important no matter what application you’re working on, but the stakes are higher with High Density Interconnect (HDI) technologies.
