If you master
HDI PCB manufacturing, it will result in better yield and lower cost than would a through-hole design. But do you know how to design for an architecture with blind and buried vias? Take our quiz!
Congratulations, you know a lot about HDI PCB manufacturing. Try our
PCB Assembly Quiz!
#1. What should be your main PCB manufacturing concerns when designing for HDI?
Annular rings, outer copper thickness, plating, and panel size.
Registration tolerance, pads, final finish, and soldermask.
Materials, layers and laminations, vias in HDI classes, and optimal trace and space. #2. What is important when selecting a material for HDI PCB manufacturing?
Selecting a material that meets your temperature.
Selecting a material that meets your electrical performance.
Both. #3. What is considered best practice for reducing EMI for HDI PCB manufacturing?
Planning your layer sequencing.
Minimizing your number of laminations.
Choosing laser drilled via-in-pad technology. #4. How can you reduce your layer count when designing for HDI PCB manufacturing?
Reducing your number of via-in-pads.
Reducing your trace width to increase density.
Both. #5. Which of the following HDI stack-up class is the most expensive?
Two sub construction laminations.
Staggered vias sequential lamination up to three build-up layers.
Stacked vias sequential lamination up to three build-up layers. #6. What is one of the objectives of a hole fill?
To avoid annular tangency.
To help assembly form a good solder joint.
To have a better component reliability. #7. In HDI PCB manufacturing, plating a laser-drilled via shut…
Is less expensive than using a non-conductive fill.
Is more expensive than using a non-conductive fill.
Costs the same price as using a non-conductive fill. #8. In order to properly plate the via in HDI PCB manufacturing, you must define your laser drill size in proportion to…
The copper thickness.
The pad size.
The finished press-out thickness. #9. Why are 1:1 aspect ratios not optimal in HDI PCB manufacturing?
They don’t fit the pad size.
They don’t ensure a good plating.
They don’t fit the drill bit. #10. Which of the following is a particularity of staggered microvias?
No copper fill required.
Extra imaging step.
Hole fill required. #11. Which of the following is a particularity of stacked microvias?
No hole fill required.
No extra imaging step. #12. Manufacturers don’t have to fill the laser-drilled vias with copper because the second laser drill doesn’t land on the first laser drill for…
Both. #13. For staggering to be viable in HDI PCB manufacturing, the value of the vertical separation between the central access of the two microvias must…
Equal the microvia diameter.
Be less than the microvia diameter.
Be greater than the microvia diameter. #14. In a 1-N-1 type of HDI stack-up, what does N represent?
The number of mechanical buried core vias.
The number of laser microvias.
The number of layers in the first or base lamination.
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