If you master HDI PCB manufacturing, it will result in better yield and lower cost than would a through-hole design. But do you know how to design for an architecture with blind and buried vias? Take our quiz!
#1. What should be your main PCB manufacturing concerns when designing for HDI?
#2. What is important when selecting a material for HDI PCB manufacturing?
#3. What is considered best practice for reducing EMI for HDI PCB manufacturing?
#4. How can you reduce your layer count when designing for HDI PCB manufacturing?
#5. Which of the following HDI stack-up class is the most expensive?
#6. What is one of the objectives of a hole fill?
#7. In HDI PCB manufacturing, plating a laser-drilled via shut…
#8. In order to properly plate the via in HDI PCB manufacturing, you must define your laser drill size in proportion to…
#9. Why are 1:1 aspect ratios not optimal in HDI PCB manufacturing?
#10. Which of the following is a particularity of staggered microvias?
#11. Which of the following is a particularity of stacked microvias?
#12. Manufacturers don’t have to fill the laser-drilled vias with copper because the second laser drill doesn’t land on the first laser drill for…
#13. For staggering to be viable in HDI PCB manufacturing, the value of the vertical separation between the central access of the two microvias must…
#14. In a 1-N-1 type of HDI stack-up, what does N represent?
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