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Related Categories — PCB Design » PCB Manufacturing
PCB Stack-up: Plan, Design, Manufacture and Repeat
Often ignored, it is important to understand the difference between an HDI stack-up and a standard stack-up. The primary reason being the long list of advantages associated with HDI technology stack-up including, higher component density per square inch, lower aspect ratio, and lesser number of layers compared with standard stack-up.
PCB Design
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance ... more »
Case Studies
How to Design and Build a Hybrid PCB Stackup
A hybrid stackup construction enhances your PCB’s performance and cost-effectiveness by combining different materials or technologies. It helps ... more »
PCB Manufacturing
PCB Stack-up: Plan, Design, Manufacture and Repeat
Often ignored, it is important to understand the difference between an HDI stack-up and a standard stack-up. The ... more »
PCB Design
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance ... more »
Case Studies
How to Design and Build a Hybrid PCB Stackup
A hybrid stackup construction enhances your PCB’s performance and cost-effectiveness by combining different materials or technologies. It helps ... more »
PCB Manufacturing
Case Study: Designing a High-Current PCB with Voltage Doublers
PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing ... more »
Case Studies
14 Aviation and Aerospace PCB Design Rules for High Reliability
When you’re designing aerospace and aviation PCBs, you need to consider structural strength, corrosion resistance, heat dissipation, and ... more »
Defense & Space
How Via Impedance Impacts Signal Integrity in PCBs
Just like trace impedance, via impedance is also important in maintaining the signal integrity of your PCB design. ... more »
Signal Integrity
Best PCB Grounding Techniques for High-Power and HDI Designs
Incorporating proper PCB grounding techniques such as dedicated ground planes, ground vias, and galvanic isolation is critical in ... more »
PCB Design
Aerospace PCB Design Tips for Efficient Thermal Management
Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »
PCB Design
How Via Stitching Facilitates High-Current PCB Designs
Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »
PCB Design
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards