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12 PCB Thermal Management Techniques to Reduce PCB Heating
Modern electronics use high-power components like high-performance processors, MOSFETs, high-power LEDs, IGBTs, etc. We know there is a trend in electronic industries to make these components smaller but this results in the creation of thermal hotspots. High temperatures at PCB thermal hotspots could result in device failure.
PCB Design
Wire Bonding: An Efficient Interconnection Technique
For an IC package to function as intended, the channel that connects it to the power supply should ... more »
PCB Assembly
IPC-2223 Standards and Design Violations for Rigid-Flex Boards
Rigid-flex circuit boards are the best solution for space-constrained environments. They can withstand a significant number of flex ... more »
Flex PCBs
12 PCB Thermal Management Techniques to Reduce PCB Heating
Modern electronics use high-power components like high-performance processors, MOSFETs, high-power LEDs, IGBTs, etc. We know there is a ... more »
PCB Design
Wire Bonding: An Efficient Interconnection Technique
For an IC package to function as intended, the channel that connects it to the power supply should ... more »
PCB Assembly
IPC-2223 Standards and Design Violations for Rigid-Flex Boards
Rigid-flex circuit boards are the best solution for space-constrained environments. They can withstand a significant number of flex ... more »
Flex PCBs
Common Errors Encountered in Discrete Components
Component selection is one of the important steps in the PCB design process. As a designer, be aware ... more »
PCB Assembly
Design for Testing (DFT) Guidelines for PCB Manufacturing
Testing and examining a PCB after manufacturing is a pivotal factor in procuring a flawless design. Design for ... more »
PCB Assembly
Design and Manufacture of Staggered and Stacked Vias in PCBs
Staggered and stacked vias are well adapted nowadays. Their unique design enhances the density, as well as boosts ... more »
PCB Design
OhmegaPly and TCR Materials with Embedded Passives Technology in PCB Manufacturing
OhmeagPly (resistive conductive material) and TCR material (thin-film resistor foil) follow the method of embedded passives technology (EPT) ... more »
PCB Manufacturing
Lamination Voids and Delamination in PCB Manufacturing
Lamination voids refer to the absence of epoxy resin in a circuit board. This can be detected while ... more »
PCB Manufacturing
HDI Standard Board Tools for a Better PCB design
Unlike traditional PCBs, HDI boards can obtain interconnections through blind vias, buried vias, and microvias, instead of just ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards