During DesignCon 2018, we met with Gustavo Blando, Senior Principal Engineer at Oracle. We discussed material characterization, transmission lines, differential pairs, how placing vias can reduce crosstalk… among other things!
During DesignCon 2018, Sierra interviewed the Signal Integrity Evangelist Eric Bogatin. We could not resist to ask him about his first DesignCon. “You know, I looked back at all the DesignCons that I’ve been to, and I think it was in 1992, he said. It was back in the old days when it was the HP High-Speed Digital Symposium, so it’s been a long time.” Listen to this PCB expert’s thoughts on technology, crosstalk, PAM-4, educating the new class of PCB designers, and the signal integrity market.
During DesignCon 2018, we interviewed many PCB experts. Chris Scholz is one of them. He works as a Product Manager for vector network analyzers at Rohde & Schwarz North America and told us all about the biggest challenges in measuring crosstalk.
During DesignCon 2018, we met Bill Hargin, “Director of Everything” at Z-Zero, an innovative PCB stack-up design company. Bill told us about Z-Zero’s stack-up tool and shared some precious tips for PCB designers.
During DesignCon 2018, we interviewed many PCB experts. Antonio Ciccomancini Scogna is one of them. He works as a Principal Engineer at Samsung, and part of his mission is to solve signal integrity issues that can appear when designing printed circuit boards for powerful smartphones.
During PCB West 2017, last month in Santa Clara, Sierra had the pleasure of meeting many speakers. We interviewed these PCB experts from Zuken, Cadence, Nano Dimension, Altium, Rogers Corp and AkroMetrix. They shared their best PCB tips to help you make the best choices when you design your boards.
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