Gustavo Blando: “A ground via next to a differential pair can reduce the amount of crosstalk”

During DesignCon 2018, we met with Gustavo Blando, Senior Principal Engineer at Oracle. We discussed material characterization, transmission lines, differential pairs, how placing vias can reduce crosstalk… among other things!

Continue reading “Gustavo Blando: “A ground via next to a differential pair can reduce the amount of crosstalk””

Eric Bogatin: “The crosstalk problems can limit what PAM-4 can do”

During DesignCon 2018, Sierra interviewed the Signal Integrity Evangelist Eric Bogatin. We could not resist to ask him about his first DesignCon. “You know, I looked back at all the DesignCons that I’ve been to, and I think it was in 1992, he said. It was back in the old days when it was the HP High-Speed Digital Symposium, so it’s been a long time.” Listen to this PCB expert’s thoughts on technology, crosstalk, PAM-4, educating the new class of PCB designers, and the signal integrity market.

Continue reading “Eric Bogatin: “The crosstalk problems can limit what PAM-4 can do””