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Related Categories — IPC » PCB Materials
Case Study: Eliminating BOM and Footprint Errors in PCB Assembly
Sticking to DFA benchmarks ensures components are correctly assembled on a PCB without any discrepancies. DFA brings down unnecessary production […]
Case Studies
Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
How Sequential Lamination is Performed to Manufacture HDI PCBs
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
Case Study: Eliminating BOM and Footprint Errors in PCB Assembly
Sticking to DFA benchmarks ensures components are correctly assembled on a PCB without any discrepancies. DFA brings down ... more »
Case Studies
Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
How Sequential Lamination is Performed to Manufacture HDI PCBs
Sequential lamination is a process of fabricating a circuit board using subsets composed of copper and dielectric layers. ... more »
HDI / Blind & Buried Vias
Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
How to Optimize Your PCB Trace Using IPC-2152 Standard
IPC-2152 is the standard for determining the current capacity, temperature rise, and width of a trace in a ... more »
IPC
Benefits of Choosing Turnkey PCB Manufacturing and Assembly from a Single Facility
Turnkey PCB manufacturing services include design review, fabricating bare boards, procuring components, assembly, and testing of your prototype. ... more »
PCB Assembly
What is a PCB Transmission Line?
A PCB transmission line is a type of interconnection used for moving signals from their transmitters to their ... more »
Controlled Impedance
Applying IPC-2221 Standards in Circuit Board Design
IPC-2221 is a generic standard for circuit board design. It lays down the requirements for PCB design and ... more »
IPC
7 Must-Knows for Your Flex PCB Design
Flex PCB design requires a slightly different approach than rigid PCBs. While flex PCBs can provide major savings ... more »
Flex PCBs
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards