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Related Categories — High Current » PCB Design » PCB Layout
6 Common Solder Mask Errors Every PCB Designer Should Know
A solder mask is an insulation layer that covers conductive areas such as traces and pads. Inappropriate solder layer application […]
PCB Design
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance ... more »
Case Studies
Case Study: Designing a High-Current PCB with Voltage Doublers
PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing ... more »
Case Studies
6 Common Solder Mask Errors Every PCB Designer Should Know
A solder mask is an insulation layer that covers conductive areas such as traces and pads. Inappropriate solder ... more »
PCB Design
Case Study: Routing Microcontroller and BGA in Rigid-Flex PCBs
When routing microcontrollers and BGAs, you need to consider the trace spacing requirements of your design and clearance ... more »
Case Studies
Case Study: Designing a High-Current PCB with Voltage Doublers
PCBs with high operating current and voltage should adhere to specific layout rules to avert overheating and arcing ... more »
Case Studies
Best PCB Grounding Techniques for High-Power and HDI Designs
Incorporating proper PCB grounding techniques, such as dedicated ground planes, ground vias, and galvanic isolation, is critical in building reliable and ... more »
PCB Design
Aerospace PCB Design Tips for Efficient Thermal Management
Advanced electronics in aerospace applications experience temperature fluctuations. A good aerospace PCB thermal management system isolates sections with ... more »
PCB Design
How Via Stitching Facilitates High-Current PCB Designs
Via stitching in high-current PCBs helps in creating proper ground connections, power distribution, and heat dissipation. These boards ... more »
PCB Design
Case Study: Designing 8 and 14-Layer HDI PCBs with Stacked Vias
Stacked vias are considered the most suitable solution for manufacturing HDI boards with advanced features. The configuration, with ... more »
Case Studies
Case Study: Designing an HDI Board with 0.4 and 0.65 mm BGAs
BGA technology makes it possible to achieve a smaller form factor in PCBs. With a higher pin count, ... more »
Case Studies
How to Optimize Your PCB Trace Using the IPC-2152 Standard
IPC-2152 is the standard for determining the current capacity, temperature rise, and width of a trace in a ... more »
IPC
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