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Related Categories — IPC » PCB Design
PCB Stack-up: Plan, Design, Manufacture and Repeat
Often ignored, it is important to understand the difference between an HDI stack-up and a standard stack-up. The primary reason being the long list of advantages associated with HDI technology stack-up including, higher component density per square inch, lower aspect ratio, and lesser number of layers compared with standard stack-up.
PCB Design
5 DFM Issues Designers Should Check Before PCB Manufacturing
Every PCB should be designed in such a way that the overall cost and chances of potential DFM ... more »
PCB Design
How to Choose the Right PCBs for IC Integration
Selecting the right PCBs for IC integration depends on the chip’s signal characteristics, power demands, and the end ... more »
PCB Assembly
PCB Stack-up: Plan, Design, Manufacture and Repeat
Often ignored, it is important to understand the difference between an HDI stack-up and a standard stack-up. The ... more »
PCB Design
5 DFM Issues Designers Should Check Before PCB Manufacturing
Every PCB should be designed in such a way that the overall cost and chances of potential DFM ... more »
PCB Design
How to Choose the Right PCBs for IC Integration
Selecting the right PCBs for IC integration depends on the chip’s signal characteristics, power demands, and the end ... more »
PCB Assembly
IPC Class 2 VS Class 3: The Different Design Rules
As circuit board manufacturers, designers often ask us about the difference between IPC Class 2 and Class 3. ... more »
IPC
Why Controlled Impedance Really Matters
Every day, PCB designs and components become smaller, faster – in other words, more complicated. It is now ... more »
Controlled Impedance
A Complete Guide to PCB Interfaces and Communication Protocols
The choice of the PCB interface plays a critical role in enabling efficient protocol layering, minimizing crosstalk, and ... more »
High Speed
Designing Transmission Lines with Controlled Impedance in High-Speed PCB Layouts
Imagine you’re designing PCB transmission lines for a high-speed application. You’ve routed critical interfaces like PCIe and USB ... more »
Controlled Impedance
Decoupling Capacitor Placement Guidelines Every PCB Designer Should Know
Decoupling is a way of isolating signal components from composite signals based on frequency. Therefore, understanding which range ... more »
PCB Layout
Analyzing Eye Diagrams for Signal Integrity in High-Speed PCBs
An eye diagram is one of the most effective methods for analyzing the signal integrity of your PCB ... more »
PCB Design
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards