High-Density Interconnection or HDI substrates are multi-layer, high-density circuits with features including the fine line and well-defined space patterns. Increasing adoption of HDI substrates enhances the overall functionality of PCBs and limit the operational area. Continue reading “How to Avoid Crosstalk in HDI Substrate?”
Yes, It may Ruin Your PCB In-house Party.
Traces within the PCB are used to connect various components to various connectors. These traces can be identified as continuous paths of copper that exist on the surface of a circuit board. The trace width becomes crucial as it directly impacts on the working of the PCB. Additionally, increasing electricity flowing through PCB traces produces an immense amount of heat. Monitoring trace widths also helps minimize the heat build-up that typically occurs on boards. The conductor width also determines the resistance of the traces that directly affect the electricity flow.
Vias are miniature conductive pathways drilled into the PCB to establish electrical connectivity between the different layers. Basically, a via is a vertical trace in a PCB.
This presentation will discuss how to properly select PCB laminates or materials. Before selecting begins, there are many factors to consider. Make sure material characteristics fit your specific board requirements and end application. Today, we will focus on the dielectric properties, cost, and manufacturability of materials suitable for high-speed PCB designs.
PCB etching is a process of removal of unwanted copper (Cu) from the circuit board. When I say unwanted, it is nothing but the non-circuit copper that is removed from the board. As a result, the desired circuit pattern is achieved.
Measuring ultra-low impedances (20 micro-ohm) is a challenge for any power distribution network (PDN) design engineer. The 2-port shunt-through measurement is the standard method for measuring milliohm impedances up to very high frequencies (GHz). Unfortunately, this measurement includes an undesirable ground loop related to the instrument grounds and test setup cabling. The ground loop introduces significant errors if proper care is not taken. This application note shows how to measure as low as 20 μΩ using the Picotest J2102A as a ground loop breaker.