Design for manufacturing (DFM) guidelines resolve potential issues that can occur during the manufacturing and assembly of circuit boards. DFM […]
Flex PCBs
The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller ... more »
HDI / Blind & Buried Vias
Most modern devices employ differential signaling to meet high-speed and high data-rate needs. Controlling differential signaling in rigid ... more »
Controlled Impedance
Design for manufacturing (DFM) guidelines resolve potential issues that can occur during the manufacturing and assembly of circuit ... more »
Flex PCBs
The main agenda of using HDI technology is to pack more components on a smaller board. Choosing smaller ... more »
HDI / Blind & Buried Vias
Most modern devices employ differential signaling to meet high-speed and high data-rate needs. Controlling differential signaling in rigid ... more »
Controlled Impedance
Once a circuit board designer prepares the design, the next step is to find a manufacturer to transform ... more »
PCB Assembly
Impedance matching is the way of configuring the input impedance of a load or the output impedance of ... more »
Controlled Impedance
Cost optimization is one of the major objectives when designing a PCB. To achieve that, every designer should ... more »
Flex PCBs
Depending on component technology, many options exist for automated mass soldering today. But wave soldering was the first ... more »
PCB Assembly
PCB outgassing or off-gassing is a defect that occurs when air is trapped inside a circuit board during ... more »
PCB Assembly
Black pad has long been a problem for ENIG surface finishes. What are the best ways to work ... more »
PCB Manufacturing
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.