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Case Study: Gold Wire Ball Bonding Against Reflow
As evident of these series of tests, multiple rounds of reflow do not appear to negatively impact the bondability of the gold plating. However, while the reflow process does not seem to affect the surface condition of the gold, the gold thickness should be kept to a minimum (1.2 ± 4σ µin per IPC-4556) if better bondability is desired.
Case Studies
NASA Case Study: Sensor Web Instruments
This NASA case study was originally published in Tech Briefs. It was written by Joshua Forgione, Electronics Engineer, ... more »
Case Studies
HDI PCB Case Study: Partner Early for HDI Board Design
HDI PCB Case Study: When customers want to design HDI boards that are as compact as possible, there ... more »
Case Studies
Case Study: Gold Wire Ball Bonding Against Reflow
As evident of these series of tests, multiple rounds of reflow do not appear to negatively impact the ... more »
Case Studies
NASA Case Study: Sensor Web Instruments
This NASA case study was originally published in Tech Briefs. It was written by Joshua Forgione, Electronics Engineer, ... more »
Case Studies
HDI PCB Case Study: Partner Early for HDI Board Design
HDI PCB Case Study: When customers want to design HDI boards that are as compact as possible, there ... more »
Case Studies
Case Study: Quickturn PCB Prototype for Bluetooth Application
Punch Through Design sends prototype circuit board designs to Sierra Circuits, who is then able to turn around ... more »
Case Studies
Case Study: Custom BGA for MIT Particle Physicist
Physicists explore the fundamental constituents of matter by accelerating subatomic particles to speeds approaching that of light and ... more »
Case Studies
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