High-Density Interconnection or HDI substrates are multi-layer, high-density circuits with features including the fine line and well-defined space patterns. Increasing adoption of HDI substrates enhances the overall functionality of PCBs and limit the operational area. Continue reading “How to Avoid Crosstalk in HDI Substrate?”
In this video, Keysight ADS SI application scientist Tim Wang Lee shows you how to use basic signal integrity (SI) analyses such as eye diagrams, S-parameters, TDR and single pulse response to solve signal integrity problems.
Marko Marin, Technical Account Manager at Ansys, stopped by our booth at DesignCon to answer a few questions about signal integrity.
Controlled impedance printed circuit boards (PCBs) often include a measurement “coupon”, which typically includes sample traces, 6 inches long and constructed as part of the printed circuit board panel. They are measured to assure the PCB stack-up and the accuracy of the PCB transmission lines. These coupons, as well as the actual PCB signal traces, interconnects and cables are typically measured using a Time Domain Reflectometer (TDR). A TDR is generally a large, expensive instrument that includes a high-speed edge pulse and a sampling oscilloscope.
We met with Rick Hartley during PCB West 2018 to discuss signal integrity, controlled impedance and other PCB designers’ pain points. What can you do to improve your designs? Listen to the master!
Bill Hargin and Don DeGroot are “working on an every-man’s VNA” for measuring the properties of PCB materials with the help of Sierra. Learn more in Bill’s interview!