HDI is a complex PCB technology that uses blind, buried and micro vias. HDI is characterized by its high density of components and routing interconnections, which can pain a pain to design for. Can you handle it? Take the quiz!
One thing PCB designers will all agree on is that to breakout a BGA, you need precision and discipline. When you breakout a BGA, you basically apply a fanout solution and route traces from those fanouts to the perimeter of the device prior to general routing of the PCB.
At some level of circuit complexity, turning to an architecture with blind and buried vias will result in better yield and lower cost than would a through-hole design. In this presentation, we discuss several design examples and illustrate the relative costs and benefits of different architectural approaches.
The healthcare space has seen tremendous technological advancements in recent years. Among the myriad of shifts that have occurred—the rise of electronic medical records, the development of new imaging capabilities, and so on—one of the most noteworthy is also, in a sense, one of the smallest: the accelerating popularity of wearables devices within the medical industry. Continue reading “Wearables, Medical Devices’ Popularity Accelerating in Health Space”
Choosing the right dielectric material for a PCB is important no matter what application you’re working on, but the stakes are higher with High Density Interconnect (HDI) technologies. Continue reading “HDI PCBs: Choosing The Right Material”
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