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Related Categories — HDI / Blind & Buried Vias » PCB Manufacturing
The History of High Density Interconnect
Implementing HDI at modern levels involved making changes in materials, imaging, assembly, testing, and design. This article examines those changes and takes a look at what we might see in the near future, as HDI continues to change the way we look at complex, compact circuits and the devices they make possible.
HDI / Blind & Buried Vias
Manufacturing Profitable HDI PCBs
Yield Drives Profit The first step toward designing a printed circuit board is to identify the least expensive ... more »
HDI / Blind & Buried Vias
Key Aspects of DFM for HDI PCBs
Design for manufacturability (DFM) for HDI PCBs refers to designing layouts that reduce the errors associated with fabrication ... more »
The History of High Density Interconnect
Implementing HDI at modern levels involved making changes in materials, imaging, assembly, testing, and design. This article examines ... more »
HDI / Blind & Buried Vias
Manufacturing Profitable HDI PCBs
Yield Drives Profit The first step toward designing a printed circuit board is to identify the least expensive ... more »
HDI / Blind & Buried Vias
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
- Bundled together in an entirely-online process
- Reviewed and tested by Engineers
- DFA & DFM Checks on every order
- Shipped from Silicon Valley in as fast as 5 days
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
- Rigid PCBs, built to IPC-6012 Class 2 Specs
- 2 mil (0.002″) trace / space
- DFM Checks on every order
- 24-hour turn-times available
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.
- Complex PCB requirements
- Mil-Spec & Class 3 with HDI Features
- Blind & Buried Vias
- Flex & Rigid-Flex boards