Rigid PCBKnow what’s in your board
Know what’s in your board
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- Fabrication only or full turnkey available
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Rigid PCB Capabilities
Advanced capabilities may require a custom order.
PCB Attributes
| Product Features | Standard | Advanced | Micro |
| Min Layer Count | 1 | 1 | 1 |
| Max Layer Count | 30 | 30 | 30 |
| Min Board Thickness | .010” | .005” | .005″ |
| Max Board Thickness | .250” | .250” | .250″ |
| Min Core Thickness | .004” | .002” | .002″ |
| Min Dielectric | .004” | .003” | .002″ |
| Min Starting Copper Foil Weight | 9 microns | 9 microns | 5 micron |
| Max Finished Copper Thickness (O/L) | 4 oz | 6 oz | 1 oz |
| Max Finished Copper Thickness (I/L) | 4 oz | 4 oz | 0.5 oz |
| Min Panel Size | 12” x 18” | 12” x 18” | 12″ x 18″ |
| Max Panel Size | 18” x 24” | 21” x 29” | 12″ x 18″ |
| Smallest Mechanical Drill Diameter | .0059” | .0059” | .0059″ |
| Smallest Laser Drill Diameter | .005″ | .004″ | .004″ |
| Min Finished Hole Size | .004” | .002” | .002″ |
| Max Through Hole Aspect Ratio (depending on board thickness and finish hole) | 10:1 | 10:1 | > 10:1 |
| Max Laser Via Aspect Ratio | .75:1 | .75:1 | .75:1 |
| Blind Via Finished Hole Size | .004” | Plated Shut | Plated shut |
| Buried Via Finished Hole Size | .004” | .002” | .002″ |
| Min Trace and Space | .004” | .003” | 0.002″ |
| Min Pad Size for Test | .005” | .005” | .005″ |
| Process Pad Diameter | D + .012” (1-mil Annular Ring) | D + .008” (Tangency) | D + .008” (Tangency) |
| Stacked Vias | Yes | Yes | Yes |
| Min Wire Bond Pad Size | > .006” | .004” | 0.004″ |
| Controlled Impedance Tolerance | 10% | 5% | 5% |
| Solder Mask Registration | .002” | .001” | .001″ |
| Solder Mask Feature Tolerance | .0015” | .001” | .001” |
| Solder Mask Min Dam Size (based on green soldermask color) | .005” | .004” | .004″ |
| Min Diameter Route Cutter Available | .024” | .021” | .021″ |
| Routed Part Size Tolerance | .005” | .003” | 0.003″ |
| Laser Hole Location Tolerance | .0005” | .0005” | .0005″ |
| Laser Routed Part Size Tolerance ( can only be done with panels < .032” thick) | .002” | .002” | .001″ |
| Bow and Twist Tolerance | Per IPC Spec | Per IPC Spec | Per IPC Spec |
| Thickness Tolerance (based on board thickness) | 10% | 5% | 5% |
| Sequential Laminations | 3 or less Lamination Cycles | 4 Lamination Cycles | 5 Lamination cycles |
| Buried Vias | Yes | Yes | Yes |
| Blind Vias | Yes | Yes | Yes |
| Conductive Filled Vias | Yes | Yes | Yes – Cu plate shut |
| Non Conductive Filled Vias | Yes | Yes | Yes |
Surface Finishes
| Product Features | Standard | Advanced | Micro |
| HASL (Vertical or Horizontal) | Yes | Yes | No |
| Lead Free HASL | Yes | Yes | No |
| OSP (Shikoku F2) | Yes | Yes | Yes |
| OSP (Entek) | Yes | Yes | Yes |
| ENIG (Electroless Nickel/Immersion Gold) | Yes | Yes | Yes |
| Immersion Silver | Yes | Yes | No |
| Electrolytic Soft Gold | Yes | Yes | Yes |
| Electrolytic Hard Gold | Yes | Yes | Yes |
| Selective Gold | Yes | Yes | Yes |
Solder Mask Finishes
| Product Features | Standard | Advanced | Micro |
| Semi – Glossy | Yes | Yes | Yes |
| Glossy | Yes | Yes | Yes |
| Matte | Yes | Yes | Yes |
Solder Mask Colors
| Product Features | Standard | Advanced | Micro |
| Green | Yes | Yes | Yes |
| Black | Yes | Yes | Yes |
| Red | Yes | Yes | Yes |
| Blue | Yes | Yes | Yes |
| Yellow | Yes | No | No |
| White | Yes | No | No |
| Clear | Yes | Yes | Yes |
| Bright White | Yes | No | No |
| Purple | Yes | No | No |
Legend
| Product Features | Standard | Advanced | Micro |
| All Colors | Yes | Yes | Yes |
Fab
| Product Features | Standard | Advanced | Micro |
| Routed Array | Yes | Yes | Yes |
| V Score, Edge to Copper | .01” | .007” | .007″ |
| V Score Angles | 35°, 45°, 60° | 35°, 45°, 60° | 35°, 45°, 60° |
| Countersink | Yes | Yes | Yes |
| Counterbore | Yes | Yes | Yes |
| Bevel | Yes | Yes | Yes |
| Milling | +/- .003” | +/- .002” | +/- .001” |
| Edge Castellation | Yes | Yes | Yes |
| Edge Plating | Yes | Yes | Yes |
| Heatsinks | No | Yes | No |
Electrical Test
| Product Features | Standard | Advanced | Micro |
| 10 Volt | Yes | Yes | Yes |
| 40 Volt (Burn-In Boards) | Yes | Yes | Yes |
| 250 Volt | No | Yes | Yes |
| 500 Volt | No | Yes | Yes |
| Hi Pot | No | Yes | Yes |
Laminate Materials
| Product Features | Standard | Advanced | Micro |
| Arlon 85NT | No | Yes | No |
| Bergquist | No | Yes | No |
| Flexible Polyimide | No | Yes | Yes |
| Hybrid Constructions | Yes | Yes | Yes |
| Isola 370HR | Yes | Yes | Yes |
| Isola FR406 | Yes | Yes | Yes |
| Isola FR408 HR | Yes | Yes | Yes |
| Isola P95 | Yes | Yes | Yes |
| Isola P96 | Yes | Yes | Yes |
| Iteq IT180 | Yes | Yes | Yes |
| Nelco BT N5000 | Yes | Yes | Yes |
| Nelco N4000-13 | Yes | Yes | Yes |
| Nelco N4000-29 | Yes | Yes | No |
| Nelco N7000-2 | Yes | Yes | Yes |
| No Flow Prepreg | Yes | Yes | Yes |
| Panasonic Megtron | Yes | Yes | Yes |
| Panasonic R1755 | Yes | Yes | No |
| Panasonic R1766 | Yes | Yes | Yes |
| Polyclad Getek | Yes | Yes | Yes |
| PSA Bond Film | No | Yes | Yes |
| Rogers 3000 Series | Yes | Yes | No |
| Rogers R4000 Series | Yes | Yes | No |
| Rogers 5000 Series | Yes | Yes | No |
| Rogers 6000 Series | Yes | Yes | No |
| Rogers TMM | Yes | Yes | No |
| Ventec VT47 | Yes | No | No |
Available Reports
| Product Features | Standard | Advanced | Micro |
| Microsection | Yes | Yes | Yes |
| Solderability | Yes | Yes | Yes |
| X-Ray Fluorescence | Yes | Yes | Yes |
| Ionic Contamination | Yes | Yes | Yes |
| Time Domain Reflectometry Test (TDR) | Yes | Yes | Yes |
| FAI | Yes | Yes | Yes |
| Certificate of Compliance | Yes | Yes | Yes |
UL
| Product Features | Standard | Advanced | Micro |
| 94VO | Yes | Yes | No |
PCB Classifications Mil-Spec
| Product Features | Standard | Advanced | Micro |
| MIL-PRF-55110 | Yes | No | No |
| MIL-PRF-31032/1 | Yes | No | No |
| MIL-PRF-31032/2 | Yes | No | No |
| IPC 6012, Class 1, 2 and 3 | Yes | Yes | Yes |
| ISO 9001:2015 | Yes | Yes | Yes |
| ISO 13485:2016 | Yes | Yes | Yes |
Note: For the full list of Mil-Spec approved capabilities please see the Mil-Specs Capabilities page
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