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Rigid PCB Capabilities

Advanced capabilities may require a custom order.

PCB Attributes

Product FeaturesStandardAdvancedMicro
Min Layer Count111
Max Layer Count303030
Min Board Thickness.010” (.254 mm).005” (.127 mm).005″ (.127 mm)
Max Board Thickness.250” (6.35 mm).250” (6.35 mm) .250″ (6.35 mm)
Min Core Thickness.004” (.102 mm) .002” (.051 mm) .002″ (.051 mm)
Min Dielectric.004” (.102 mm) .003” (.076 mm) .002″ (.051 mm)
Min Starting Copper Foil Weight9 microns9 microns5 micron
Max Finished Copper Thickness (O/L)4 oz (118 ml)6 oz (177 ml)1 oz (30 ml)
Max Finished Copper Thickness (I/L)4 oz (118 ml)4 oz (118 ml)0.5 oz (15 ml)
Min Panel Size12” x 18” (30 x 46 cm) 12” x 18” (30 x 46 cm) 12″ x 18″ (30 x 46 cm)
Max Panel Size12” x 18” (30 x 46 cm) 21” x 29” (53 x 74 cm)18″ x 24″ (46 x 61 cm)
Smallest Mechanical Drill Diameter.0059” (.150 mm).0059” (.150 mm) .0059″ (.150 mm)
Smallest Laser Drill Diameter.005″ (.127 mm) .004″ (.102 mm) .004″ (.102 mm)
Min Finished Hole Size.004” (.102 mm) .002” (.051 mm).002″ (.051 mm)
Max Through Hole Aspect Ratio (depending on board thickness and finish hole)10:110:1> 10:1
Max Laser Via Aspect Ratio.75:1 .75:1 .75:1
Blind Via Finished Hole Size.004” (.102 mm) Plated ShutPlated shut
Buried Via Finished Hole Size.004” (.102 mm) .002” (.051 mm) .002″ (.051 mm)
Min Trace and Space.004” (.102 mm) .003” (.076 mm) .002″ (.051 mm)
Min Pad Size for Test.005” (.127 mm) .005” (.127 mm) .005″ (.127 mm)
Process Pad DiameterD + .012” (.305 mm) (1-mil (.025-mm) Annular Ring)D + .008” (.203 mm) (Tangency) D + .008” (.203 mm) (Tangency)
Stacked ViasYesYesYes
Min Wire Bond Pad Size> .006” (.152 mm).004” (.102 mm) .004″ (.102 mm)
Controlled Impedance Tolerance10%5%5%
Solder Mask Registration.002” (.051 mm) .001” (.025 mm).001″ (.025 mm)
Solder Mask Feature Tolerance.0015” (.038 mm).001” (.025 mm) .001” (.025 mm)
Solder Mask Min Dam Size (based on green soldermask color).005” (.127 mm) .004” (.102 mm) .004″ (.102 mm)
Min Diameter Route Cutter Available.024” (.610 mm).021” (.533 mm).021″ (.533 mm)
Routed Part Size Tolerance.005” (.127 mm) .003” (.076 mm) .003″ (.076 mm)
Laser Hole Location Tolerance.0005” (.013 mm).0005” (.013 mm) .0005″ (.013 mm)
Laser Routed Part Size Tolerance ( can only be done with panels < .032” thick).002” (.051 mm) .002” (.051 mm) .001″ (.025 mm)
Bow and Twist TolerancePer IPC SpecPer IPC SpecPer IPC Spec
Thickness Tolerance (based on board thickness)10%5%5%
Sequential Laminations3 or less Lamination Cycles4 Lamination Cycles5 Lamination cycles
Buried ViasYesYesYes
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes – Cu plate shut
Non Conductive Filled ViasYesYesYes

Surface Finishes

Product FeaturesStandardAdvancedMicro
HASL (Vertical or Horizontal)YesYesNo
Lead Free HASLYesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIG (Electroless Nickel/Immersion Gold)YesYesYes
Immersion SilverYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective GoldYesYesYes

Solder Mask Finishes

Product FeaturesStandardAdvancedMicro
Semi – GlossyYesYesYes
GlossyYesYesYes
MatteYesYesYes

Solder Mask Colors

Product FeaturesStandardAdvancedMicro
GreenYesYesYes
BlackYesYesYes
RedYesYesYes
BlueYesYesYes
YellowYesNoNo
WhiteYesNoNo
ClearYesYesYes
Bright WhiteYesNoNo
PurpleYesNoNo

Legend

Product FeaturesStandardAdvancedMicro
All ColorsYesYesYes

Fab

Product FeaturesStandardAdvancedMicro
Routed ArrayYesYesYes
V Score, Edge to Copper.01”.007” (.178 mm).007″ (.178 mm)
V Score Angles35°, 45°, 60°35°, 45°, 60°35°, 45°, 60°
CountersinkYesYesYes
CounterboreYesYesYes
BevelYesYesYes
Milling+/- .003” (.076 mm) +/- .002” (.051 mm) +/- .001” (.025 mm)
Edge CastellationYesYesYes
Edge PlatingYesYesYes
HeatsinksNoYesNo

Electrical Test

Product FeaturesStandardAdvancedMicro
10 VoltYesYesYes
40 Volt (Burn-In Boards)YesYesYes
250 VoltNoYesYes
500 VoltNoYesYes
Hi PotNoYesYes

Laminate Materials

Product FeaturesStandardAdvancedMicro
Arlon 85NTNoYesNo
BergquistNoYesNo
Flexible Polyimide No Yes Yes
Hybrid ConstructionsYesYesYes
Isola 370HR Yes Yes Yes
Isola FR406YesYesYes
Isola FR408 HRYesYesYes
Isola P95YesYesYes
Isola P96YesYesYes
Iteq IT180YesYesYes
Nelco BT N5000 Yes Yes Yes
Nelco N4000-13YesYesYes
Nelco N4000-29YesYesNo
Nelco N7000-2YesYesYes
No Flow PrepregYesYesYes
Panasonic Megtron Yes Yes Yes
Panasonic R1755 Yes Yes No
Panasonic R1766 Yes Yes Yes
Polyclad GetekYesYesYes
PSA Bond FilmNoYesYes
Rogers 3000 SeriesYesYesNo
Rogers R4000 SeriesYesYesNo
Rogers 5000 SeriesYesYesNo
Rogers 6000 SeriesYesYesNo
Rogers TMMYesYesNo
Ventec VT47YesNoNo

Available Reports

Product FeaturesStandardAdvancedMicro
MicrosectionYesYesYes
SolderabilityYesYesYes
X-Ray FluorescenceYesYesYes
Ionic ContaminationYesYesYes
Time Domain Reflectometry Test (TDR)YesYesYes
FAIYesYesYes
Certificate of ComplianceYesYesYes

UL

Product FeaturesStandardAdvancedMicro
94VOYesYesNo

PCB Classifications Mil-Spec

Product FeaturesStandardAdvancedMicro
MIL-PRF-55110YesNoNo
MIL-PRF-31032/1YesNoNo
MIL-PRF-31032/2YesNoNo
IPC 6012, Class 1, 2 and 3YesYesYes
ISO 9001:2015YesYesYes
ISO 13485:2016YesYesYes

Note: For the full list of Mil-Spec approved capabilities please see the Mil-Specs Capabilities page