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Rigid PCB Capabilities

Advanced capabilities may require a custom order.

PCB Attributes

Product FeaturesStandardAdvancedMicro
Min Layer Count111
Max Layer Count303030
Min Board Thickness.010”.005”.005″
Max Board Thickness.250”.250”.250″
Min Core Thickness.004”.002”.002″
Min Dielectric.004”.003”.002″
Min Starting Copper Foil Weight9 microns9 microns5 micron
Max Finished Copper Thickness (O/L)4 oz6 oz1 oz
Max Finished Copper Thickness (I/L)4 oz4 oz0.5 oz
Min Panel Size12” x 18”12” x 18”12″ x 18″
Max Panel Size12” x 18”21” x 29”18″ x 24″
Smallest Mechanical Drill Diameter.0059”.0059”.0059″
Smallest Laser Drill Diameter.005″.004″.004″
Min Finished Hole Size.004”.002”.002″
Max Through Hole Aspect Ratio (depending on board thickness and finish hole)10:110:1> 10:1
Max Laser Via Aspect Ratio.75:1 .75:1 .75:1
Blind Via Finished Hole Size.004”Plated ShutPlated shut
Buried Via Finished Hole Size.004”.002”.002″
Min Trace and Space.004”.003”0.002″
Min Pad Size for Test.005”.005”.005″
Process Pad DiameterD + .012” (1-mil Annular Ring)D + .008” (Tangency) D + .008” (Tangency)
Stacked ViasYesYesYes
Min Wire Bond Pad Size> .006”.004”0.004″
Controlled Impedance Tolerance10%5%5%
Solder Mask Registration.002”.001”.001″
Solder Mask Feature Tolerance.0015”.001” .001”
Solder Mask Min Dam Size (based on green soldermask color).005”.004”.004″
Min Diameter Route Cutter Available.024”.021”.021″
Routed Part Size Tolerance.005”.003”0.003″
Laser Hole Location Tolerance.0005”.0005”.0005″
Laser Routed Part Size Tolerance ( can only be done with panels < .032” thick).002”.002”.001″
Bow and Twist TolerancePer IPC SpecPer IPC SpecPer IPC Spec
Thickness Tolerance (based on board thickness)10%5%5%
Sequential Laminations3 or less Lamination Cycles4 Lamination Cycles5 Lamination cycles
Buried ViasYesYesYes
Blind ViasYesYesYes
Conductive Filled ViasYesYesYes – Cu plate shut
Non Conductive Filled ViasYesYesYes

Surface Finishes

Product FeaturesStandardAdvancedMicro
HASL (Vertical or Horizontal)YesYesNo
Lead Free HASLYesYesNo
OSP (Shikoku F2)YesYesYes
OSP (Entek)YesYesYes
ENIG (Electroless Nickel/Immersion Gold)YesYesYes
Immersion SilverYesYesNo
Electrolytic Soft GoldYesYesYes
Electrolytic Hard GoldYesYesYes
Selective GoldYesYesYes

Solder Mask Finishes

Product FeaturesStandardAdvancedMicro
Semi – GlossyYesYesYes

Solder Mask Colors

Product FeaturesStandardAdvancedMicro
Bright WhiteYesNoNo


Product FeaturesStandardAdvancedMicro
All ColorsYesYesYes


Product FeaturesStandardAdvancedMicro
Routed ArrayYesYesYes
V Score, Edge to Copper.01”.007”.007″
V Score Angles35°, 45°, 60°35°, 45°, 60°35°, 45°, 60°
Milling+/- .003” +/- .002” +/- .001”
Edge CastellationYesYesYes
Edge PlatingYesYesYes

Electrical Test

Product FeaturesStandardAdvancedMicro
10 VoltYesYesYes
40 Volt (Burn-In Boards)YesYesYes
250 VoltNoYesYes
500 VoltNoYesYes
Hi PotNoYesYes

Laminate Materials

Product FeaturesStandardAdvancedMicro
Arlon 85NTNoYesNo
Flexible Polyimide No Yes Yes
Hybrid ConstructionsYesYesYes
Isola 370HR Yes Yes Yes
Isola FR406YesYesYes
Isola FR408 HRYesYesYes
Isola P95YesYesYes
Isola P96YesYesYes
Iteq IT180YesYesYes
Nelco BT N5000 Yes Yes Yes
Nelco N4000-13YesYesYes
Nelco N4000-29YesYesNo
Nelco N7000-2YesYesYes
No Flow PrepregYesYesYes
Panasonic Megtron Yes Yes Yes
Panasonic R1755 Yes Yes No
Panasonic R1766 Yes Yes Yes
Polyclad GetekYesYesYes
PSA Bond FilmNoYesYes
Rogers 3000 SeriesYesYesNo
Rogers R4000 SeriesYesYesNo
Rogers 5000 SeriesYesYesNo
Rogers 6000 SeriesYesYesNo
Rogers TMMYesYesNo
Ventec VT47YesNoNo

Available Reports

Product FeaturesStandardAdvancedMicro
X-Ray FluorescenceYesYesYes
Ionic ContaminationYesYesYes
Time Domain Reflectometry Test (TDR)YesYesYes
Certificate of ComplianceYesYesYes


Product FeaturesStandardAdvancedMicro

PCB Classifications Mil-Spec

Product FeaturesStandardAdvancedMicro
IPC 6012, Class 1, 2 and 3YesYesYes
ISO 9001:2015YesYesYes
ISO 13485:2016YesYesYes

Note: For the full list of Mil-Spec approved capabilities please see the Mil-Specs Capabilities page