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Rigid PCB Capabilities
Advanced capabilities may require a custom order.
PCB Attributes
Product Features | Standard | Advanced | Micro |
Min Layer Count | 1 | 1 | 1 |
Max Layer Count | 30 | 30 | 30 |
Min Board Thickness | .010” | .005” | .005″ |
Max Board Thickness | .250” | .250” | .250″ |
Min Core Thickness | .004” | .002” | .002″ |
Min Dielectric | .004” | .003” | .002″ |
Min Starting Copper Foil Weight | 9 microns | 9 microns | 5 micron |
Max Finished Copper Thickness (O/L) | 4 oz | 6 oz | 1 oz |
Max Finished Copper Thickness (I/L) | 4 oz | 4 oz | 0.5 oz |
Min Panel Size | 12” x 18” | 12” x 18” | 12″ x 18″ |
Max Panel Size | 18” x 24” | 21” x 29” | 12″ x 18″ |
Smallest Mechanical Drill Diameter | .0059” | .0059” | .0059″ |
Smallest Laser Drill Diameter | .005″ | .004″ | .004″ |
Min Finished Hole Size | .004” | .002” | .002″ |
Max Through Hole Aspect Ratio (depending on board thickness and finish hole) | 10:1 | 10:1 | > 10:1 |
Max Laser Via Aspect Ratio | .75:1 | .75:1 | .75:1 |
Blind Via Finished Hole Size | .004” | Plated Shut | Plated shut |
Buried Via Finished Hole Size | .004” | .002” | .002″ |
Min Trace and Space | .004” | .003” | 0.002″ |
Min Pad Size for Test | .005” | .005” | .005″ |
Process Pad Diameter | D + .012” (1-mil Annular Ring) | D + .008” (Tangency) | D + .008” (Tangency) |
Stacked Vias | Yes | Yes | Yes |
Min Wire Bond Pad Size | > .006” | .004” | 0.004″ |
Controlled Impedance Tolerance | 10% | 5% | 5% |
Solder Mask Registration | .002” | .001” | .001″ |
Solder Mask Feature Tolerance | .0015” | .001” | .001” |
Solder Mask Min Dam Size (based on green soldermask color) | .005” | .004” | .004″ |
Min Diameter Route Cutter Available | .024” | .021” | .021″ |
Routed Part Size Tolerance | .005” | .003” | 0.003″ |
Laser Hole Location Tolerance | .0005” | .0005” | .0005″ |
Laser Routed Part Size Tolerance ( can only be done with panels < .032” thick) | .002” | .002” | .001″ |
Bow and Twist Tolerance | Per IPC Spec | Per IPC Spec | Per IPC Spec |
Thickness Tolerance (based on board thickness) | 10% | 5% | 5% |
Sequential Laminations | 3 or less Lamination Cycles | 4 Lamination Cycles | 5 Lamination cycles |
Buried Vias | Yes | Yes | Yes |
Blind Vias | Yes | Yes | Yes |
Conductive Filled Vias | Yes | Yes | Yes – Cu plate shut |
Non Conductive Filled Vias | Yes | Yes | Yes |
Surface Finishes
Product Features | Standard | Advanced | Micro |
HASL (Vertical or Horizontal) | Yes | Yes | No |
Lead Free HASL | Yes | Yes | No |
OSP (Shikoku F2) | Yes | Yes | Yes |
OSP (Entek) | Yes | Yes | Yes |
ENIG (Electroless Nickel/Immersion Gold) | Yes | Yes | Yes |
Immersion Silver | Yes | Yes | No |
Electrolytic Soft Gold | Yes | Yes | Yes |
Electrolytic Hard Gold | Yes | Yes | Yes |
Selective Gold | Yes | Yes | Yes |
Solder Mask Finishes
Product Features | Standard | Advanced | Micro |
Semi – Glossy | Yes | Yes | Yes |
Glossy | Yes | Yes | Yes |
Matte | Yes | Yes | Yes |
Solder Mask Colors
Product Features | Standard | Advanced | Micro |
Green | Yes | Yes | Yes |
Black | Yes | Yes | Yes |
Red | Yes | Yes | Yes |
Blue | Yes | Yes | Yes |
Yellow | Yes | No | No |
White | Yes | No | No |
Clear | Yes | Yes | Yes |
Bright White | Yes | No | No |
Purple | Yes | No | No |
Legend
Product Features | Standard | Advanced | Micro |
All Colors | Yes | Yes | Yes |
Fab
Product Features | Standard | Advanced | Micro |
Routed Array | Yes | Yes | Yes |
V Score, Edge to Copper | .01” | .007” | .007″ |
V Score Angles | 35°, 45°, 60° | 35°, 45°, 60° | 35°, 45°, 60° |
Countersink | Yes | Yes | Yes |
Counterbore | Yes | Yes | Yes |
Bevel | Yes | Yes | Yes |
Milling | +/- .003” | +/- .002” | +/- .001” |
Edge Castellation | Yes | Yes | Yes |
Edge Plating | Yes | Yes | Yes |
Heatsinks | No | Yes | No |
Electrical Test
Product Features | Standard | Advanced | Micro |
10 Volt | Yes | Yes | Yes |
40 Volt (Burn-In Boards) | Yes | Yes | Yes |
250 Volt | No | Yes | Yes |
500 Volt | No | Yes | Yes |
Hi Pot | No | Yes | Yes |
Laminate Materials
Product Features | Standard | Advanced | Micro |
Arlon 85NT | No | Yes | No |
Bergquist | No | Yes | No |
Flexible Polyimide | No | Yes | Yes |
Hybrid Constructions | Yes | Yes | Yes |
Isola 370HR | Yes | Yes | Yes |
Isola FR406 | Yes | Yes | Yes |
Isola FR408 HR | Yes | Yes | Yes |
Isola P95 | Yes | Yes | Yes |
Isola P96 | Yes | Yes | Yes |
Iteq IT180 | Yes | Yes | Yes |
Nelco BT N5000 | Yes | Yes | Yes |
Nelco N4000-13 | Yes | Yes | Yes |
Nelco N4000-29 | Yes | Yes | No |
Nelco N7000-2 | Yes | Yes | Yes |
No Flow Prepreg | Yes | Yes | Yes |
Panasonic Megtron | Yes | Yes | Yes |
Panasonic R1755 | Yes | Yes | No |
Panasonic R1766 | Yes | Yes | Yes |
Polyclad Getek | Yes | Yes | Yes |
PSA Bond Film | No | Yes | Yes |
Rogers 3000 Series | Yes | Yes | No |
Rogers R4000 Series | Yes | Yes | No |
Rogers 5000 Series | Yes | Yes | No |
Rogers 6000 Series | Yes | Yes | No |
Rogers TMM | Yes | Yes | No |
Ventec VT47 | Yes | No | No |
Available Reports
Product Features | Standard | Advanced | Micro |
Microsection | Yes | Yes | Yes |
Solderability | Yes | Yes | Yes |
X-Ray Fluorescence | Yes | Yes | Yes |
Ionic Contamination | Yes | Yes | Yes |
Time Domain Reflectometry Test (TDR) | Yes | Yes | Yes |
FAI | Yes | Yes | Yes |
Certificate of Compliance | Yes | Yes | Yes |
UL
Product Features | Standard | Advanced | Micro |
94VO | Yes | Yes | No |
PCB Classifications Mil-Spec
Product Features | Standard | Advanced | Micro |
MIL-PRF-55110 | Yes | No | No |
MIL-PRF-31032/1 | Yes | No | No |
MIL-PRF-31032/2 | Yes | No | No |
IPC 6012, Class 1, 2 and 3 | Yes | Yes | Yes |
ISO 9001:2015 | Yes | Yes | Yes |
ISO 13485:2016 | Yes | Yes | Yes |
Note: For the full list of Mil-Spec approved capabilities please see the Mil-Specs Capabilities page