The certifications you need.

We design, manufacture and assemble your IPC Class 3A circuit boards in just 2 days for standard boards. Our PCB experts and engineers guide you from beginning to end while delivering all the traceability and tolerance documents you need.

Upload your data to receive a review of your design and a quote.

 Experience our expertise and feel the difference.

The documentation we provide:

  • Certificate of Conformance
  • Material Specifications
  • Reflow Profile Copy (included with First Article)
  • Photo Requirements
  • First Article Inspection Report
  •  IPC J-STD-001E
  •  Record of calibrated tools used during manufacturing
  •  AOI Report or Visual Inspection Report
  •  Flying Probe or In-Circuit Testing Report
  •  Ionic Cleanliness Test Report
  • Etc.


Product FeaturesRigidHDI [1]Rigid-Flex
Max layer count3024+\-16
Min board thickness.010 in..010 in.
Max board thickness.250 in..250 in.
Min core thickness.002 in..002 in..001 in.
Min dielectric thickness.002 in..002 in..001 in.
Min starting copper foil thickness/weight9 microns (0.25 oz)9 microns (0.25 oz)9 microns (0.25 oz)
Max finished copper thickness/weight (O/L)6 oz.2 oz.2 oz.
Max finished copper thickness/weight (I/L)6 oz.2 oz.2 oz.
Min panel size12 in. x 18 in.12 in. x 18 in.12 in. x 18 in.
Max panel size21 in. x 29 in.21 in. x 29 in.12 in. x 18 in.
Smallest mech drill diameter.0059 in..005 in..0059 in.
Smallest laser drill diameter.004 in..004 in..003 in.
Max thru-hole aspect ratio10:110:110:1
Max blind via aspect ratio.75:1.75:1.75:1
Min drill-to-copper clearance.006 in..005 in..008 in.
Min trace and space width.003 in..003 mils.0035 in.
Min pad size for test.005 in..004 in..005 in.
Process pad diameterD + .012 in. (1 mil annular ring)D + .010 in. (1 mil annular ring)D + .014 in. (1 mil annular ring)
Stacked viasYesYesNo
Min wire bond pad size> .004 in.> .003 in.005 in.
Controlled impedance tolerance [2]10%10%10%
Solder mask registration.002 in.Within .001 in.Within .002 in.
Solder mask feature tolerance.001 in..001 in..001 in.
Solder mask min dam size.004 in..004 in. (SMT).0035 in. (BGA).005 in.
Min diameter route cutter.024 in..024 in..024 in.
Mech routed part size tolerance+/-5+/-5+/-5
Laser hole location tolerance.001 in..001 in..001in.
Laser routed part size tolerance -can only be done with panels <.032″ thick.001 in..001 in..001 in.
Bow and twist tolerancePer IPC Spec7%7% along rigid area
Thickness tolerance10%10%10%
Sequential laminations343
Conductive filled viasYesYesNo
Non-conductive filled viasYesYesYes