Standard Technology PCBs

FEATURE

STANDARD TECHNOLOGY

OVERALL BOARD FEATURES

LAYER COUNT

UP TO 12

THICKNESS MINIMUM

.025"

THICKNESS MAXIMUM

200"

THICKNESS TOLERANCE

+/- 10%

BOW AND TWIST TOLERANCE

7%

MAXIMUM PCB Panel SIZE(s)

Up to 10" X 16" (on a 12" X 18" panel; this panel size is commonly used)

Up to 16" X 22" (on a 18" X 24" panel; this panel size is commonly used)

Up to 19" X 27" (on a 21" X 29" panel; this panel size is not as common)

MATERIALS AND DIELECTRICS

MATERIALS

FR-4 FAMILY

POLYIMIDE

GETEK

THERMOUNT FAMILY

ROGERS 3000 SERIES

ROGERS 4000 SERIES

BONDING SHEETS - PRE-PREG

TO MATCH CORE MATERIAL

HYBRID CONSTRUCTIONS

INNER LAYER THICKNESS MINIMUM

.005"

DIELECTRIC MINIMUM

.003"

OUTER COPPER THICKNESS - MIN (BASE)

.0007" (1/2 OZ)

INNER LAYER COPPER THICKNESS - MAX

.0028" (2 OZ)

OUTER COPPER THICKNESS - MIN (BASE)

.0007" (1/2 OZ)

OUTER COPPER THICKNESS - MAX (BASE)

Holes

SMALLEST MECHANICALLY DRILLED HOLE

.010"

SMALLEST LASER HOLE

.006"

PLATING - SPECIAL HOLES - MIN

.0008"

MAXIMUM PLATING IN HOLES

.01" to .02"

PLATED HOLE TOLERANCE - DIAMETER

.004"

PLATING ASPECT RATIO - MAXIMUM

10:1

HOLE PREP TYPE

PERMANGANATE

PLASMA

LINE AND SPACE

INNER LAYER LINE WIDTH MINIMUM

.005"

INNER TRACE WIDTH TOLERANCE

+/-.001"

OUTER LAYER LINE WIDTH MINIMUM

0.005"

OUTER LAYER SPACE MINIMUM

0.005"

OUTER TRACE WIDTH TOLERANCE

+/-.001"

PADS

PAD SIZE OVER HOLE DIAMETER

0.15"

SOLDERMASK

TYPE

LPI - MOST COLORS

THERMAL CURE

PAD CLEARANCE MINIMUM

.006"

MINIMUM LINE WIDTH - MASK

.005"

REGISTRATION TOLERANCE

.004"

FINAL FINISH

HOT AIR LEVEL

.0005" to 0.015"

HARD GOLD

30-50 MICROINCHES

SELECTIVE GOLD

30-50 MICROINCHES

SOFT BONDABLE GOLD

20-40 MICROINCHES

FULL BODY GOLD

20-40 MICROINCHES

ELECTROLESS NICKEL

100-200 MICROINCHES

IMMERSION GOLD

3-5 MICROINCHES

IMMERSION TIN

TIN/NICKEL

100-300 MICROINCHES

IMMERSION SILVER

3-4 MICROINCHES

LEGEND

TYPE

MOST COLORS

CHARACTER LINE WIDTH MINIMUM

.007"

FINAL FABRICATION

COUNTERSINK

V-GROOVE ARRAY

ROUTED PIECE

MOST COLORS

V-GROOVE ARRAYCOUNTERBORE

EDGE BEVEL

EDGE - MILL

MINIMUM INSIDE RADIUS

0.15"

ELECTRICAL TEST

TYPE

CLAM-SHELL

FLYING PROBE

TDR

TEST SPECIFICATION

IPC CLASS I, II, III

REPORTS AVAILABLE ON REQUEST

TYPE

MICROSECTION

SOLDERABILITY

X-RAY FLUORESCENCE

IONIC CONTAMINATION

CONTROLLED IMPEDANCE

TESTING

TDR

TYPE

SINGLE END

DIFFERENTIAL

METAL CORE

TYPE

ALUMINUM

BLIND VIA PROCESSING

TYPE

SEQUENTIAL LAM

SMALLEST HOLE

.006"

SILVER OR EPOXY FILL

AVAIL SEQ LAM

MICRO VIA PROCESSING

SMALLEST HOLE

.010"

SILVER OR EPOXY FILL

.010"

MICRO VIA PROCESSING

SMALLEST HOLE

.006"

CAPTURE PAD OVER HOLE SIZE - MIN

.012"

PLATING ASPECT RATIO

.5:1

DIELECTRIC - MICROVIA LAYER

.002" (+/- .0005)

MATERIALS - MICROVIA LAYER

RESIN COATED FOIL

NON-WOVEN ARAMID

PCB SPECIFICATIONS

IPC CLASS

IPC-A-600 CLASS I, II, III

MILITARY

ROUTED PIECE

LEAD TIMES

24 HOUR - QUICK TURN

75 HOUR - QUICK TURN

MEDIUM VOLUME

HIGH VOLUME

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