RIGID PCB MANUFACTURING CAPABILITIES
We produce PCBs using state-of-the-art machines for processes such as Direct Imaging, Laser Drilling, Reverse Pulse Plating and Flying-Probe net-list testing. Other examples of machines are: Camtek/Pentax Laser Direct Imaging (LDI), Printar automated screen legend, ESI laser drills. Our premier plant is the high technology, 46,000 sq. ft., ISO 9001:2015, ISO 13485:2016 and Milspec MIL-PRF-31032 certified facility in Sunnyvale, California.
Since 1986, we have continuously re-invested in our capabilities and training to manufacture the best PCB's possible. So whether it is etching, drilling, engineers or technical advisors, our technology and our people are state of the art. And that's why customers have rated our manufacturing process as one of the best in the PCB industry for over thirty years. Browse our Capabilities online, download our brochure, or give us a call to find out what really makes us cutting-edge.
RIGID PCB CAPABILITIES LIST
| Product Features | Standard | Advanced | Micro Electronics |
|---|---|---|---|
|
PC Board Attributes |
|||
| Min Layer count | 1 | 1 | 1 |
| Max Layer Count | 30 | 30 | 30 |
| Min Board Thickness | .010" | .004" | .004" |
| Max Board Thickness | 0.250" | 0.250" | 0.250" |
| Min Core Thickness | .002" | .002" | .002" |
| Min Dielectric | .002" | .002" | .002" |
| Min. Starting Copper Foil Weight | 9 micron | 3 micron | 3 micron |
| Max. Finished Copper Thickness (O/L) | 6 oz | > 6 oz | .0015" |
| Max. Finished Copper Thickness (I/L) | 4 oz | > 4 oz | .001" |
| Maximum Panel Size | 21" x 29" | 21" x 29" | 12" x 18" |
| Minimum Panel Size | 12" x 18" | 12" x 18" | 8" x 8" |
| Smallest Mech Drill Diameter | .0059" | .004" | .004" |
| Smallest Laser Drill Diameter | .0040" / .0080" | .0025" / .0100" | .0025" / .0100" |
| Min Finished Hole Size | .004" | .002" | Plated shut |
| Max Thru Hole Aspect Ratio | 10:1 | 16:1 | 16:1 |
| Max Blind Via Aspect Ratio | .75:1 | 1.2:1 | .8:1 |
| Blind Via Finished Hole Size | .004" | Plated shut | Plated shut |
| Buried Via Finished Hole Size | .004" | .002" | .002" |
| Minimum Line Width (trace) and Spacing | .003" | .002" | .00125" |
| Min Pad Size for test | .005" | .003" | .003" |
| Process Pad Diameter | D + .012" (1 mil annular ring) | D + .010" (Tangency) | D + .006" |
| Stacked vias | Yes | Yes | Yes |
| Minimum Wire Bond Pad size | > .006" | .004" | 0.0025" |
| Controlled Impedance Tolerance | 10% | 5% | 5% |
| Solder Mask Registration | .002" | <.002" | .002" |
| Solder Mask Feature Tolerance | .001" | .001" | .001" |
| Solder Mask Min Dam Size | .004" | .004" | .004" |
| Min. Diameter Rout Cutter Available | .024" | .021" | .021" |
| Routed Part Size Tolerance | .010" | <.010" | <.010" |
| Laser hole location Tolerance | .0005" | .0005" | .0005" |
| Laser Routed Part Size Tolerance - can only be done with panels <.032" thick | .001" | .001" | .001" |
| Bow & Twist Tolerance | Per IPC Spec | Per IPC Spec | Per IPC Spec |
| Thickness Tolerance | 10% | < 10% | < 10% |
| Sequential Lam | 3 or less lam cycles | > 3 lam cycles | > 3 lam cycles |
| Buried Vias | 2 or less | > 3 | > 3 |
| Blind Vias | Yes | Yes | Yes |
| Conductive Filled Vias | Yes | Yes | Yes - Cu plate shut |
| Non Conductive Filled Vias | Yes | Yes | Yes |
|
Surface Finishes |
|||
| HASL (Vertical or Horizontal) | Yes | Yes | No |
| OSP (Shikoku F2) | Yes | Yes | Yes |
| OSP (Entek) | Yes | Yes | Yes |
| ENIG (Electroless Nickel/Immersion Gold) | Yes | Yes | Yes |
| ENEPIG (Electroless Nickel-Electroless Paladium-Immersion Gold) | Yes | Yes | Yes |
| Immersion Silver | Yes | Yes | Yes |
| Tin Nickel | Yes | Yes | No |
| Electrolytic Soft Gold | Yes | Yes | Yes |
| Electrolytic Hard Gold | Yes | Yes | Yes |
| Selective Gold | Yes | Yes | Yes |
|
Solder Masks Finish |
|||
| Semi - Glossy | Yes | Yes | Yes |
| Glossy | Yes | Yes | Yes |
| Matte | Yes | Yes | Yes |
|
Solder Mask Colors |
|||
| Green | Yes | Yes | Yes |
| Black | Yes | Yes | Yes |
| Red | Yes | Yes | Yes |
| Blue | Yes | Yes | Yes |
| Yellow | Yes | Yes | Yes |
| White | Yes | Yes | Yes |
| Clear | Yes | Yes | Yes |
| Bright White | Yes | Yes | Yes |
| Purple | Yes | Yes | Yes |
|
Legend |
|||
| All colors | Yes | Yes | Yes |
|
Fab |
|||
| Routed Array | Yes | Yes | Yes |
| V Score, Edge to Copper | 0.01" | 0.007" | 0.007" |
| V Score Angles | 35°,45°,60° | 35°,45°,60° | 35°,45°,60° |
| Countersink | Yes | Yes | Yes |
| Counterbore | Yes | Yes | Yes |
| Bevel | Yes | Yes | Yes |
| Milling | +/- .003" | +/- .003" | +/- .001" |
| Edge Castellation | Yes | Yes | Yes |
| Edge Plating | Yes | Yes | Yes |
| Heatsinks | Yes | Yes | No |
|
Electrical Test |
|||
| 10 Volt | Yes | Yes | Yes |
| 40 Volt (Burn in bds) | Yes | Yes | Yes |
| 250 Volt | No | Yes | Yes |
| 500 Volt | No | Yes | Yes |
| Hi Pot | No | Yes | No |
|
Laminate Materials |
|||
| Very Thin Film | No | Yes | Yes |
| Arlon 85NT | Yes | Yes | No |
| Bergquist | Yes | Yes | No |
| Hybrid Constructions | Yes | Yes | Yes |
| Isola FR406 | Yes | Yes | Yes |
| Isola FR408 | Yes | Yes | Yes |
| Isola IS410 | Yes | Yes | Yes |
| Isola IS620 | No | Yes | No |
| Isola P95 | Yes | Yes | Yes |
| Isola P96 | Yes | Yes | Yes |
| Iteq IT180 | Yes | Yes | Yes |
| Panasonic R1766 | Yes | Yes | Yes |
| Panasonic R1755 | Yes | Yes | No |
| Panasonic Megtron | Yes | Yes | No |
| Nelco N4000-13 | Yes | Yes | Yes |
| Nelco N4000-29 | Yes | Yes | No |
| Nelco BT N5000 | Yes | Yes | Yes |
| Nelco N7000-2 | Yes | Yes | Yes |
| No Flow Pre Preg | Yes | Yes | Yes |
| Isola 370HR | Yes | Yes | Yes |
| Polyclad Getek | Yes | Yes | Yes |
| PSA Bond Film | No | Yes | Yes |
| Rogers 3000 Series | Yes | Yes | No |
| Rogers R4000 Series | Yes | Yes | No |
| Rogers 5000 Series | Yes | Yes | No |
| Rogers 6000 Series | Yes | Yes | No |
| Rogers TMM | Yes | Yes | No |
|
Available Reports |
|||
| Microsection | Yes | Yes | Yes |
| Solderability | Yes | Yes | Yes |
| X-ray Fluorescence | Yes | Yes | Yes |
| Ionic Contamination | Yes | Yes | Yes |
| Time Domain Reflectometry test (TDR) | Yes | Yes | Yes |
| FAI | Yes | Yes | Yes |
| Certificate of Compliance (C of C) | Yes | Yes | Yes |
|
UL |
|||
| 94VO | Yes | Yes | No |
|
PCB Classifications |
|||
|
Milspec |
|||
| MIL-PRF-55110 | Yes | No | No |
| MIL-PRF-31032/2 | Yes | No | No |
| MIL-PRF-31032/1 | Yes | No | No |
| IPC 6012, Class 1, 2 & 3 | Yes | Yes | Yes |
| ISO 9001:2015 | Yes | Yes | Yes |
| ISO 13485:2016 | Yes | Yes | Yes |
| Quoting/Ordering | Most standard technology PCBs can be quoted and ordered instantly. Some restrictions may apply in our online offerings. Read the specific product specs for details. | For complex PCBs, please Request a Custom Quote | For complex PCBs, please Request a Custom Quote |
PCB Capabilities By Market:
High Reliability PC Boards
- Up to 2000 Thermal cycles
- For PC Boards that must not fail
Burn-in Boards
- .5 mm pitch
- Step-down connectors
- Special materials
- High Reliability
High Technology Boards
- Microelectronics (Line and Space down to .00125"/.00125")
(learn more) - Differential Impedance
- Up to 30 Layers
- Lead Free process
- Special materials
- Sequential lamination
- Blind and buried vias
- Laser Drill
- Filled vias
- Via in pads
- Milspec
- Metal core
- Carbon paste
- Plated edges
- Plated edge holes
- Milling
- Heavy Copper
- Selective Finishes
Standard Technology Boards
- 1 to 10 Layers
- Trace/Space 5/5
- Same day for 2 Layers
- 24 hours to 10 Days for multilayers
- Lead Free process
- All standard materials
PCB Capabilities By Process:
Front-end CAM
- Fully automated Tooling System
Imaging-Laser Direct Imaging
- Trace/Space 2/2
Multilayer Lamination
- Up to 30 Layers
- Sequential lamination
- Automated registration
Drilling
- .006" Mechanical Drill
- Laser Drill down to 2 mils (.002")
Etching
- Trace/Space 2/2 mils
Plating
- Aspect ratio 10+
Soldermask
- LPI, Dry Film
- LDI under solder mask
Silkscreen
- Automated
- 5 mil lines
- LPI & Hand silkscreen
Fabrication
- Route and retain
- Scoring
Electrical Test
- .5mm pitch, Flying probe and High Density grid
Materials
- Lead Free FR-4
- Polyimides
- Rogers 4003 & 4350
- Teflons
- Ceramics
- Most other materials
