We produce PCBs using state-of-the-art machines for processes such as Direct Imaging, Laser Drilling, Reverse Pulse Plating and Flying-Probe net-list testing. Other examples of machines are: Camtek/Pentax Laser Direct Imaging (LDI), Printar automated screen legending (www.printar.com). Our premier plant is the high technology, 46,000 sq. ft., ISO 9001:2015, ISO 13485:2016 and Milspec MIL-PRF-55110 certified facility in Sunnyvale, California. Since 1986, we have continuously re-invested in our capabilities and training to manufacture the best PCB's possible. So whether it is etching, drilling, engineers or technical advisors, our technology and our people are state of the art. And that's why customers have rated our manufacturing process as one of the best in the PCB industry for over twenty years. Browse our Capabilities online, download our brochure, or give us a call to find out what really makes us cutting-edge.
See our Equipment List here. See some pictures from our Sunnyvale facility here. See our Flex & Rigid-Flex PCB Capabilities here. See our PCB Assembly Capabilities here.
RIGID PCB CAPABILITIES LIST
Product Features
Standard
Advanced
Micro Electronics
PC Board Attributes
Min Layer count
1
1
1
Max Layer Count
24
26+
26+
Min Board Thickness
.010"
.004"
.004"
Max Board Thickness
.200"
.200" +
.200" +
Min Core Thickness
.002"
.002"
.002"
Min Dielectric
.002"
.001"
.001"
Min. Starting Copper Foil Weight
9 micron
3 micron
3 micron
Max. Finished Copper Thickness (O/L)
6 oz
> 6 oz
.0015"
Max. Finished Copper Thickness (I/L)
4 oz
> 4 oz
.001"
Maximum Panel Size
21" x 29"
21" x 29"
12" x 18"
Minimum Panel Size
12" x 18"
12" x 18"
8" x 8"
Smallest Mech Drill Diameter
.0059"
.004"
.004"
Smallest Laser Drill Diameter
.0030" / .0080"
.0025" / .0100"
.0025" / .0100"
Min Finished Hole Size
.004"
.002"
Plated shut
Max Thru Hole Aspect Ratio
10:1
16:1
16:1
Max Blind Via Aspect Ratio
.75:1
1.2:1
.8:1
Blind Via Finished Hole Size
.004"
Plated shut
Plated shut
Buried Via Finished Hole Size
.004"
.002"
.002"
Minimum Line Width (trace) and Spacing
.003"
.002"
.00125"
Min Pad Size for test
.005"
.003"
.003"
Process Pad Diameter
D + .012" (1 mil annular ring)
D + .010" (Tangency)
D + .006"
Stacked vias
Yes
Yes
Yes
Minimum Wire Bond Pad size
> .006"
.004"
0.0025"
Controlled Impedance Tolerance
10%
5%
5%
Solder Mask Registration
.002"
<.002"
.002"
Solder Mask Feature Tolerance
.001"
.001"
.001"
Solder Mask Min Dam Size
.004"
.002"
.002"
Min. Diameter Rout Cutter Available
.024"
.021"
.021"
Routed Part Size Tolerance
.010"
<.010"
<.010"
Laser hole location Tolerance
.0005"
.0005"
.0005"
Laser Routed Part Size Tolerance - can only be done with panels <.032" thick
