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Signal Integrity for Embedded Computing Applications

Headshot of Matthew Burns

Matthew Burns

Global Director of Technical Marketing
Samtec


Life in the fast lane – Signal integrity for embedded computing applications

Embedded computing developers face new design challenges implementing high-speed protocols like 100 GbE, USB4, PCIe 5.0, DDR4/5, and more. This webinar introduces fundamental signal integrity concepts like insertion loss, return loss, and crosstalk, and relates them to a case study of the connector design for the COM-HPC Module Base Specification Revision 1.2 featuring the new COM-HPC Mini form factor.

When selecting high-speed connectors, several critical parameters need consideration. These include material properties such as dielectric constant and insertion loss, as well as ensuring impedance control and addressing signal integrity concerns like crosstalk. Additionally, exploring advanced connector technologies offers advantages, particularly in high-speed differential signaling. Understanding the design principles and considerations behind these connectors is crucial. Finally, implementing layout guidelines tailored to optimize connector performance and maintain signal integrity further enhances the effectiveness of the chosen connectors in high-speed PCB designs.

 

What you’ll learn:

  • It’s more than the connector – Channel-level signal integrity
  • Signal types
  • Key SI parameters/design criteria
    a. Impedance matching
    b. Insertion loss
    c. Return loss
    d. Crosstalk
    e. Design examples
  • Signal integrity “rules of thumb”
  • Design tips to improve channel performance
  • High-speed design case study – PICMG COM-HPC® Mini Modules

 

Meet the speaker

Matthew Burns, Global Director of Technical Marketing at Samtec

Matthew Burns develops go-to-market strategies for Samtec’s Silicon-to-Silicon solutions. Over the course of 20+ years, he has been a leader in design, applications engineering, technical sales and marketing in the telecommunications, medical and electronic components industries. Mr. Burns holds a B.S. in Electrical Engineering from Penn State University.

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