Design Essentials to Maintain Signal Integrity in Class 2 and Class 3 PCBs

Amit Bahl

CRO
Sierra Circuits

Atar Mittal

General Manager of Product Development
Sierra Circuits

How to deal with signal integrity in class 2 and class 3 PCBs?

Why should you watch this webinar on signal integrity in class 3 PCBs? Because high-speed signal in class 3 boards induces hitches such as impedance discontinuity, reflection, crosstalk, and EMI during data transmission. These issues degrade the S/N ratio and distort the original signal. Noise generated from this deformed signal can interfere with the neighboring circuitries and disrupt their functionality. Eventually, the fidelity of the signal diminishes and the system may crash.

Analyzing signal integrity issues involves verifying if all frequency components of a signal have an identical degree of amplification, attenuation, and propagation delay. This verification process can be done with eye diagrams, S-parameters, and TDR measurements. To achieve uncompromised signal quality, it is essential to correlate both the simulated and measured results. With the layout files as the input, the 3D field solver deduces impedance matrices, full-wave EMI calculations, and propagation delay to identify the root cause of signal degradation. On the other hand, SI measurement involves instruments such as VNA and oscillators to endorse the simulated results.

In this webinar, our design experts will explain the best techniques to tackle signal integrity challenges.

What you’ll learn:

• Downsides of poor signal integrity in class 3 PCBs
• Factors that lead to signal degradation
• Techniques to mitigate impedance mismatch, reflection, ground bounce, signal attenuation
• SI analysis using S-parameters
• How eye pattern helps in assessing the quality of the signal
• Detecting impedance mismatch and reflection by implementing TDR measurement

Presented by Amit Bahl and Atar Mittal

Amit has been in the PCB industry for 20+ years and know the impact of signal integrity in class 3 PCBs. He is the Chief Revenue Officer at Sierra Circuits. His passion is to empower tech companies to achieve their visions and change the world. Rockets going into space, self-driving cars taking up the streets, cancer-fighting medical devices, protecting the country, he’s ready to build any circuit board!

Atar Mittal, a PCB design expert, is the Director and General Manager of the Design and Assembly Division at Sierra Circuits. He is responsible for design and development of strategies and process automation tools for complex printed circuit board and assemblies. He is also currently engaged in the development of productivity tools for electronics designers that would have a tremendous impact on shortening the development time.