Think big for your micro PCB.

We offer several options for ordering parts and assembly:

Our microelectronics division serves the fast-growing need for really small and complex PCBs for the microelectronics market. This division provides circuit boards with less than 2-mil (.051-mm) lines and spaces.

You can crosslink microelectronics with HDI (high-density interconnect) for it also uses blind, buried and micro vias.

Not ready to quote but want more info?

Upload your data to receive a quote for fabrication, assembly and component options.

 Experience our expertise and feel the difference.

Microelectronics Capabilities

PCB Attributes

Product FeaturesCapabilities
Min Layer Count1
Max Layer Count30
Min Board Thickness.005″ (.127 mm)
Max Board Thickness.250″ (6.35 mm)
Min Core Thickness.002″ (.051 mm)
Min Dielectric.002″ (.051 mm)
Min Starting Copper Foil Weight3 micron (.003 mm)
Max Finished Copper Thickness (O/L).0015″ (.038 mm)
Max Finished Copper Thickness (I/L).001″ (.025 mm)
Min Panel Size12″ x 18″ (30 x 46 cm)
Max Panel Size12″ x 18″ (30 x 46 cm)
Smallest Mechanical Drill Diameter.005″ (.127 mm)
Smallest Laser Drill Diameter.0025″ (.064 mm)
Min Finished Hole Size.002″ (.051 mm)
Max Through Hole Aspect Ratio> 10:1
Max Blind Via Aspect Ratio.8:1
Blind Via Finished Hole SizePlated shut
Buried Via Finished Hole Size.002″ (.051 mm)
Min Trace and Space.0015″ (.038 mm)
Min Pad Size for Test.003″ (.076 mm)
Process Pad DiameterD + .004″ (.102 mm)
Stacked ViasYes
Min Wire Bond Pad Size.0025″ (.064 mm)
Controlled Impedance Tolerance5%
Solder Mask Registration.001″ (.025 mm)
Solder Mask Feature Tolerance.0005″ (.013 mm)
Solder Mask Min Dam Size.003″ (.076 mm)
Min Diameter Route Cutter Available.021″ (.533 mm)
Routed Part Size Tolerance.002″ (.051 mm)
Laser Hole Location Tolerance.0005″ (.013 mm)
Laser Routed Part Size Tolerance – Can only be done with panels < .032” thick.001″ (.025 mm)
Bow and Twist TolerancePer IPC Spec
Thickness Tolerance5%
Sequential Laminations> 5 lam cycles
Buried ViasYes
Blind ViasYes
Conductive Filled ViasYes – Cu plate shut
Non Conductive Filled ViasYes

Surface Finishes

Product FeaturesCapabilities
HASL (Vertical or Horizontal)No
Lead Free HASLNo
OSP (Shikoku F2)Yes
OSP (Entek)Yes
ENIG (Electroless Nickel/Immersion Gold)Yes
Immersion SilverNo
Electrolytic Soft GoldYes
Electrolytic Hard GoldYes
Selective GoldYes

Solder Mask Finishes

Product FeaturesCapabilities
Semi – GlossyYes
GlossyYes
MatteYes

Solder Mask Colors

Product FeaturesCapabilities
GreenYes
BlackYes
RedYes
BlueYes
YellowNo
WhiteNo
ClearYes
Bright WhiteNo
PurpleNo

Legend

Product FeaturesCapabilities
All ColorsYes

Fab

Product FeaturesCapabilities
Routed ArrayYes
V Score, Edge to Copper0.007″ (.178 mm)
V Score Angles35°, 45°, 60°
CountersinkYes
CounterboreYes
BevelYes
Milling+/- .001” (.025 mm)
Edge CastellationYes
Edge PlatingYes
HeatsinksNo

Electrical Test

Product FeaturesCapabilities
10 VoltYes
40 Volt (Burn-In Boards)Yes
250 VoltYes
500 VoltYes
Hi PotYes

Laminate Materials

Product FeaturesCapabilities
Very Thin FilmYes
Arlon 85NTNo
BergquistNo
Hybrid ConstructionsYes
Isola FR406Yes
Isola FR408 HRYes
Isola P95Yes
Isola P96Yes
Iteq IT180Yes
Panasonic R1766Yes
Panasonic R1755No
Panasonic MegtronNo
Nelco N4000-13Yes
Nelco N4000-29No
Nelco BT N5000Yes
Nelco N7000-2Yes
No Flow PrepregYes
Isola 370HRYes
Polyclad GetekYes
PSA Bond FilmYes
Rogers 3000 SeriesNo
Rogers R4000 SeriesNo
Rogers 5000 SeriesNo
Rogers 6000 SeriesNo
Rogers TMMNo

Available Reports

Product FeaturesCapabilities
MicrosectionYes
SolderabilityYes
X-Ray FluorescenceYes
Ionic ContaminationYes
Time Domain Reflectometry Test (TDR)Yes
FAIYes
Certificate of ComplianceYes

UL

Product FeaturesCapabilities
94VONo

PCB Classifications Mil-Spec

Product FeaturesCapabilities
MIL-PRF-55110No
MIL-PRF-31032/1No
MIL-PRF-31032/2No
IPC 6012, Class 1, 2 and 3Yes
ISO 9001:2015Yes
ISO 13485:2016Yes