Microelectronics PCB Small Tech in Big Demand
Small Tech in Big Demand
Think big for your micro PCB.
We offer several options for ordering parts and assembly:
Our microelectronics division serves the fast-growing need for really small and complex PCBs for the microelectronics market. This division provides circuit boards with less than 2-mil (.051-mm) lines and spaces.
You can crosslink microelectronics with HDI (high-density interconnect) for it also uses blind, buried and micro vias.
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Microelectronics Capabilities
PCB Attributes
| Product Features | Capabilities |
| Min Layer Count | 1 |
| Max Layer Count | 30 |
| Min Board Thickness | .005″ (.127 mm) |
| Max Board Thickness | .250″ (6.35 mm) |
| Min Core Thickness | .002″ (.051 mm) |
| Min Dielectric | .002″ (.051 mm) |
| Min Starting Copper Foil Weight | 3 micron (.003 mm) |
| Max Finished Copper Thickness (O/L) | .0015″ (.038 mm) |
| Max Finished Copper Thickness (I/L) | .001″ (.025 mm) |
| Min Panel Size | 12″ x 18″ (30 x 46 cm) |
| Max Panel Size | 12″ x 18″ (30 x 46 cm) |
| Smallest Mechanical Drill Diameter | .005″ (.127 mm) |
| Smallest Laser Drill Diameter | .0025″ (.064 mm) |
| Min Finished Hole Size | .002″ (.051 mm) |
| Max Through Hole Aspect Ratio | > 10:1 |
| Max Blind Via Aspect Ratio | .8:1 |
| Blind Via Finished Hole Size | Plated shut |
| Buried Via Finished Hole Size | .002″ (.051 mm) |
| Min Trace and Space | .0015″ (.038 mm) |
| Min Pad Size for Test | .003″ (.076 mm) |
| Process Pad Diameter | D + .004″ (.102 mm) |
| Stacked Vias | Yes |
| Min Wire Bond Pad Size | .0025″ (.064 mm) |
| Controlled Impedance Tolerance | 5% |
| Solder Mask Registration | .001″ (.025 mm) |
| Solder Mask Feature Tolerance | .0005″ (.013 mm) |
| Solder Mask Min Dam Size | .003″ (.076 mm) |
| Min Diameter Route Cutter Available | .021″ (.533 mm) |
| Routed Part Size Tolerance | .002″ (.051 mm) |
| Laser Hole Location Tolerance | .0005″ (.013 mm) |
| Laser Routed Part Size Tolerance – Can only be done with panels < .032” thick | .001″ (.025 mm) |
| Bow and Twist Tolerance | Per IPC Spec |
| Thickness Tolerance | 5% |
| Sequential Laminations | > 5 lam cycles |
| Buried Vias | Yes |
| Blind Vias | Yes |
| Conductive Filled Vias | Yes – Cu plate shut |
| Non Conductive Filled Vias | Yes |
Surface Finishes
| Product Features | Capabilities |
| HASL (Vertical or Horizontal) | No |
| Lead Free HASL | No |
| OSP (Shikoku F2) | Yes |
| OSP (Entek) | Yes |
| ENIG (Electroless Nickel/Immersion Gold) | Yes |
| Immersion Silver | No |
| Electrolytic Soft Gold | Yes |
| Electrolytic Hard Gold | Yes |
| Selective Gold | Yes |
Solder Mask Finishes
| Product Features | Capabilities |
| Semi – Glossy | Yes |
| Glossy | Yes |
| Matte | Yes |
Solder Mask Colors
| Product Features | Capabilities |
| Green | Yes |
| Black | Yes |
| Red | Yes |
| Blue | Yes |
| Yellow | No |
| White | No |
| Clear | Yes |
| Bright White | No |
| Purple | No |
Legend
| Product Features | Capabilities |
| All Colors | Yes |
Fab
| Product Features | Capabilities |
| Routed Array | Yes |
| V Score, Edge to Copper | 0.007″ (.178 mm) |
| V Score Angles | 35°, 45°, 60° |
| Countersink | Yes |
| Counterbore | Yes |
| Bevel | Yes |
| Milling | +/- .001” (.025 mm) |
| Edge Castellation | Yes |
| Edge Plating | Yes |
| Heatsinks | No |
Electrical Test
| Product Features | Capabilities |
| 10 Volt | Yes |
| 40 Volt (Burn-In Boards) | Yes |
| 250 Volt | Yes |
| 500 Volt | Yes |
| Hi Pot | Yes |
Laminate Materials
| Product Features | Capabilities |
| Very Thin Film | Yes |
| Arlon 85NT | No |
| Bergquist | No |
| Hybrid Constructions | Yes |
| Isola FR406 | Yes |
| Isola FR408 HR | Yes |
| Isola P95 | Yes |
| Isola P96 | Yes |
| Iteq IT180 | Yes |
| Panasonic R1766 | Yes |
| Panasonic R1755 | No |
| Panasonic Megtron | No |
| Nelco N4000-13 | Yes |
| Nelco N4000-29 | No |
| Nelco BT N5000 | Yes |
| Nelco N7000-2 | Yes |
| No Flow Prepreg | Yes |
| Isola 370HR | Yes |
| Polyclad Getek | Yes |
| PSA Bond Film | Yes |
| Rogers 3000 Series | No |
| Rogers R4000 Series | No |
| Rogers 5000 Series | No |
| Rogers 6000 Series | No |
| Rogers TMM | No |
Available Reports
| Product Features | Capabilities |
| Microsection | Yes |
| Solderability | Yes |
| X-Ray Fluorescence | Yes |
| Ionic Contamination | Yes |
| Time Domain Reflectometry Test (TDR) | Yes |
| FAI | Yes |
| Certificate of Compliance | Yes |
UL
| Product Features | Capabilities |
| 94VO | No |
PCB Classifications Mil-Spec
| Product Features | Capabilities |
| MIL-PRF-55110 | No |
| MIL-PRF-31032/1 | No |
| MIL-PRF-31032/2 | No |
| IPC 6012, Class 1, 2 and 3 | Yes |
| ISO 9001:2015 | Yes |
| ISO 13485:2016 | Yes |
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