Before we start the layout design, we will do an in-house PCB stack-up design so that all the design objectives are met. We will also suggest if HDI technology is required or could help in optimization.Start Your Design Quote
When we work on your project, we create an optimized stack-up with the right number of layers based on your requirements. We decide on the necessary number of signal layers as well as power/ground layers. An important factor we take into account is the thickness of the copper layer that we determine after evaluating the current to be carried by the power layers.
When it comes to selecting PCB materials, our design engineering team examines the dielectric constant and loss factor of the dielectric material.
For high-speed and RF boards above 2 GHz, we carefully choose materials with low loss factors.
In the case of blind and buried vias, we consider the minimum via size and the aspect ratios to determine the thickness of the prepreg to be used.
As we define the copper thickness of the layers, the spacing between the traces is determined. Thicker the copper layer, bigger the spacing.
It is a common mistake to think a 4-mil spacing will be sufficient for a 2-oz copper thickness as when we etch the board, thicker the copper, the spacing between the traces will reduce and may become less than the manufacturable limits. Thinner spacing on heavy copper may lead to reworks and delays.
Sierra Circuits provides customers with stack-up design recommendations. After you place an order with us, our engineering team reviews your stack-up to ensure it is optimized for PCB manufacturing. If we notice that changes are required for a better fabrication process, we will get back to you with our suggestions.
Fabrication, Procurement, & Assembly. PCBs fully assembled in as fast as 5 days.
Fabrication. Procurement & Assembly optional. Flexible and transparent for advanced creators.
Complex technology, with a dedicated CAM Engineer. Stack-up assistance included.