PCB Via Design Guide
Sierra Circuits' PCB Via Design Guide highlights the most common DFM mistakes made by PCB designers and provides actionable tips on clearance and layout design.
The PCB Via Design Guide offers practical, real-world insights into designing reliable and manufacturable vias. It helps you make informed decisions on selecting and implementing the right via structure for your designs, including via-in-pad, stacked/staggered microvias, and thermal vias.
The design guide starts with the fundamentals, explaining when and where to use through-holes, blind, buried, and microvias. It then dives into the manufacturing processes covering drilling, plating, backdrilling, and via filling.
Drawing from actual production data, the PCB Via Design Guide highlights the most common DFM mistakes made by PCB designers and provides actionable tips on drill file setup, clearance guidelines, and layout rules. You’ll also learn how to calculate drill, pads, antipads, and annular ring sizes.
This guide also explains how vias impact signal integrity, including impedance changes, reflections, and parasitic effects. Finally, it covers the essential testing and inspection methods, including sample fabrication notes to establish clear communication with your PCB manufacturer.
And don’t forget to try our Via Impedance Calculator!
What’s inside:
- Guidelines for choosing the right via for your application
- Design rules for advanced via structures
- DFM tips to avoid manufacturing errors
- Signal integrity considerations for high-speed designs
- Testing and inspection methods for via reliability
- Fab notes
