We can perform signal integrity services on any high-speed board designs that we make. We will take care of controlled impedance and crosstalk requirements; we will take care of PCB materials that are suitable to achieve a given set of signal integrity specifications.Start Your Signal Integrity Quote
Not only are our design engineers experts in PCB routing methods and component placing that achieve our customers’ desired impedances but they can also deliver -/+ 10% tolerance, and in special cases -/+ 5%. Below are a few reasons why you should trust Sierra with even your most ambitious specifications:
Every board undergoes an impedance coupon test during the manufacturing process to ensure that we are meeting your requirements.
If not carefully designed, most high-speed boards will suffer from unwanted electromagnetic coupling that will degrade the signal integrity and cause timing delays, overshoot of voltage and chaos in logic functions due to false triggering. Our PCB designers follow a strict set of guidelines to avoid crosstalk, such as:
To ensure that we have your PCB functionality under control, we use SI simulation tools to determine crosstalk after the initial layout routing.
The part of a via that is not used for signal transmission is called a via stub. It acts as a resonant circuit with a specific resonant frequency at which it stores maximum energy. If the signal has a significant component at or near that frequency, that component will be heavily attenuated due to the energy demands of the via stub at its resonant frequency. To avoid the effects of via stubs on signal attenuation and data transfer rates, our electrical engineers calculate the maximum allowable via stub length where if ‘fmax’ is the maximum frequency component of a signal that needs to be faithfully transmitted, then the resonant frequency of the via stub should exceed ‘fmax’ by a good enough margin (usually 40%).
Pull-up or pull-down resistors on high-speed signals are common sources of stubs, which can create reflections that negatively affect signal integrity. If such resistors are required, we route the signals as a daisy chain.
When ground voltage varies with the current, we call it ground bounce. We know all too well the effects of ground bounce on signal integrity and watch out for excessive current drawn and ground and interconnect resistance, such as bonding wires and traces. Techniques we use to reduce ground bounce:
We use state-of-the-art constraint systems, like the ones offered by Cadence and Altium, to help us design out ground bounce.
Conducting line resistances and dielectric material dissipation factors impact signals as they travel over traces. Our designers control these losses in high-frequency designs where components endure greater attenuation. If not properly handled, signal attenuation may lead to a diminution in signal bandwidth, causing distortion by the increase in signal rise time that is likely to generate errors in data detection.
Selecting the right low-loss and high-speed material is essential to help with signal attenuation, as well as minimizing signal losses via control over the trace geometries.
Complex signal integrity requirements demand complex PCB layouts. Our in-house design and electrical engineers bring to the table a deep understanding of rules and techniques to minimize SI issues. We apply our best design practices so you don’t have to worry about costly design iterations.
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