Telecom PCBs

We build high-reliability telecommunications PCBs with exceptional signal performance and no transmission delays.

We are experts in building 5G boards with controlled impedance

Sierra Circuits helps you design 5G boards that support high-speed communication networks so that your device remains connected virtually without any transmission delay or latency. Our design engineers work on a regular basis with telecommunications startups and giants to help them meet their controlled impedance targets and solve their signal integrity issues.

Talk to our engineering team so we can work on your stack-up, route your single-ended and differential pair traces, place your components, vias, coupling capacitors, adjust the length matching to achieve propagation delay, and calculate your effective dielectric constant.

Other applications we serve

We manufacture printed circuit boards for various telecommunications applications, such as:

• Telecommunication towers/transceiver stations
• Cell phones
• Modems
• Connected vehicles

The testing standards we follow

Testing PCBs will ensure any existing flaws are detected earlier to prevent device failures.

Sierra Circuits offers globally certified quality management systems (QMS) that guarantee zero-defect boards. We follow the stringent fabrication criteria required by class 2 and class 3 PCBs. This means constant testing at each step of the manufacturing process, such as micro-sectioning analysis, automated optical inspection (AOI), X-ray fluorescence test, flying probe test, and other electrical tests.

• Automated optical inspection (AOI): AOI captures images of the PCB with either a single 2D camera or two 3D cameras. The captured image is compared with the schematic. If the board does not match the schematic, the board is sent to manual inspection.
• Solderability test: Ensures that the solder joints on the circuit board are reliable.
• Ionic contamination testing: Ionic contamination testing is performed to detect ionic residues resulting from the fabrication and soldering steps.
• Peel strength test: Determines the measure of strength required to peel the laminate from the circuit board.
• X-ray fluorescence (XRF): This test is used to determine the surface finish coating thickness of the board (such as for ENIG or ENIPIG coating.)
• First article inspection (FAI): This refers to the verification of around one to three pieces after the production starts in a manufacturing facility. FAI is usually performed for products that call for a high level of precision.
• Micro-sectioning analysis: This is a form of destructive testing that is carried out to determine the PCB’s quality and spot internal failures. The defects observed can range from Z-axis expansion, barrel cracks, pad lift, corner cracks, and more. It can also determine the copper thickness and solder thickness at various regions of the board.
• Flying probe test for assembly: Here test probes move from one test point to another, rapidly checking for opens, shorts, other issues with the PCBs.
• Time-domain reflectometry (TDR): TDR impedance measurements are essential for ensuring signal integrity. Signal integrity is verified by checking for electrical discontinuities in the transmission line channel and connectors.

How we meet your high-reliability requirements with full traceability

We deliver printed circuit boards according to the stringent IPC-6012 industry standard for the qualification and acceptance of bare rigid printed circuit boardsCBs for class 2 and 3. We also meet other requirements to ensure the delivery of zero-defect boards.

IPC-A-610H – Soldering requirements for telecom PCBs
This is the acceptability of electronic assembly standard, revision H. The revision has moved the ESD considerations into an individual appendix. The specifications for PCB assembly versus cable and wire harnesses were also differentiated. Target conditions which are basically the ideal operating conditions of the board were also removed.

UL 94VO
The Underwriters Laboratories standard UL 94 deals with plastics flammability and refers to the Standard for Safety of Flammability of Plastic Materials for Parts in devices and appliances testing.

Sierra Circuits rigid, flex, rigid-flex, microelectronics, and HDI boards of standard and advanced fabrications are certified by the UL 94VO standard which ensures a high level of flame retardant properties.

Reports and certifications for PCBs
Along with the standards mentioned above, we provide detailed reports and certifications for our PCBs, including:

• Micro section analysis for solderability
• X-ray fluorescence
• Ionic contamination
• Time-domain reflectometry (TDR)
• First article inspection (FAI)
• Certificate of compliance (C of C)
• Electrical test

How to quote

Let us run DFM/DFA analysis for you and get back to you with a report. You can upload your files securely through our website.

We require the following information in order to give you a quote:

• Gerber, ODB++ or IPC-2581
• BOM if you require assembly
• Quantity
• Turn time