Webinar: Ultra-HDI PCB Design and Manufacturing
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September 16th, 2026 | 9 AM PT
COST: FREE
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24
Days
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21
Hours
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46
Minutes
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22
Seconds
Amit Bahl
CRO at Sierra Circuits
This webinar will be hosted on Zoom.
Following this event, you will receive:
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Slides
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Recording
Webinar abstract:
Ultra-high density interconnect PCBs enable extremely high routing density through thin dielectric layers (<1.2 mil) and fine conductor geometries (<2 mil). When features shrink to this scale, every manufacturing variable matters. Material movement, stack-up design, laser drilling, and plating collectively determine whether an ultra-HDI design can be successfully manufactured.
In this webinar, you’ll get a closer look at UHDI PCB design and manufacturing challenges. You’ll also learn about the design techniques that can turn ultra-fine designs into successful prototypes.
Building reliable Ultra-HDI printed boards
Generally, PCB materials like FR4, Tachyon 100G, and Panasonic Megtron 6 comply with mSAP board fabrication. Opt for high-Tg laminates to support laser drilling and withstand multiple lamination cycles.
At sub-2-mil geometries, variations in copper thickness and surface profile can directly affect trace definition and imaging accuracy. Ask your fabricator to use very-low-profile (VLP) copper to achieve accurate trace dimensions. VLP copper can help achieve more consistent conductor geometries and improve fine-line fabrication.
As the number of lamination cycles increases, dimensional movement might create layer-to-layer misalignment. To avoid this, use hybrid build-ups. Have additive layers for high-density signal routing and subtractive layers for power, ground, and lower-density signals. Maintain a symmetrical build-up and balanced copper distribution to minimize warpage.
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When designing with ultra-fine circuits, understanding the potential manufacturing constraints is essential. The predominant issue is that the glass structure might influence dimensional stability. The interaction between the glass weave, dielectric thickness, and copper pattern density can affect fine-line alignment.
Plating introduces another set of challenges. At very small via geometries, achieving uniform copper deposition becomes more difficult, particularly when current density varies across the panel. Small microvias and challenging aspect ratios can increase the risk of incomplete copper coverage.
Imaging and registration become equally critical as line widths and spaces approach ultra-fine dimensions. Minor layer shifts, photoresist variations, or process distortions can translate into significant dimensional errors at the finished board level.
In this session, our manufacturing experts will walk you through these fabrication challenges and explain the process controls used to address them.
By the end of the webinar, you’ll learn how material selection, stack-up design, laser drilling, and plating come together to support reliable UHDI PCB design and manufacturing.
Register now and see how ultra-fine PCB designs turn into a manufacturable reality.
Webinar agenda:
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What is ultra-HDI?
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UHDI vs conventional HDI
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Material selection for UHDI compatibility
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Resin flow around dense copper features
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How glass structures influence laser drilling
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Stack-up considerations for minimizing registration errors
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Plating and imaging challenges at 2-mil-and-below geometries
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mSAP process for a successful ultra-HDI
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DFM guidelines for UHDI fabrication
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Questions for your PCB manufacturer before starting a UHDI design
About Amit Bahl
Amit Bahl, widely recognized as the PCB Guy, currently serves as the Chief Revenue Officer at Sierra Circuits. He earned his Bachelor of Science in Engineering from UCLA in 1997, launching his career in Silicon Valley’s tech industry. In 2009, he assumed the role of Director of Sales and Marketing at Sierra Circuits, with a dedicated focus on democratizing design for manufacturing best practices and guidelines for PCB designers and engineers.
Within a short span, Amit successfully propelled Sierra Circuits to become a leading educational platform for all aspects of PCBs. Under his leadership, Sierra expanded to offer blogs, design guides, webinars, calculators and design tools, and a vibrant forum, SierraConnect. Amit remains committed to ensuring the community has access to the essential resources, whether they are developing standard products or boards with specifications for medtech or military applications.
Assuming the position of Chief Revenue Officer since 2022, Amit’s mission persists: to simplify the PCB design journey for all stakeholders. His unwavering dedication continues to drive Sierra Circuits as a trusted resource for the PCB design community.
