Skip to main content

Webinar: Reliable Surface Finishes for Space and RF Applications

REGISTER NOW
Banner image

May 22nd, 2025 | 10 AM PT

COST: FREE

  • 1

    Day

  • 1

    Hours

  • 44

    Minutes

  • 28

    Seconds

Jose Garcia

Field Engineer, Uyemura USA

This webinar will be hosted on Zoom.

Following this event, you will receive:

  • button icon Slides

  • button icon Recording

Webinar abstract:

Choosing reliable surface finishes for your PCB can be the difference between success and failure—especially in MIL-spec or high-frequency applications. In this webinar, we’ll explore both conventional and emerging final finishes, examining their chemistry, reliability, and impact on signal performance.

 

We’ll start with widely used options like ENIG, ENEPIG, and immersion silver, comparing their cost, durability, coplanarity, and failure risks like hyper-corrosion and creep corrosion. Then we’ll move into advanced finishes including ENEPIG-Thin Ni, RAIG, EPIG, EPAG, ISIG, and DIG, evaluating their suitability for fine line designs, signal integrity, and next-gen packaging.

 

We’ll also present a side-by-side insertion loss comparison—so you can make informed decisions for RF, aerospace, or high-speed digital designs.

Register now!

Webinar agenda:

  • button icon Conventional surface finishes
    • ENIG: Pros (coplanarity, PTH coverage, shelf life) vs. cons (cost, reworkability, signal loss, hyper-corrosion)
    • ENEPIG: Performance with both Au and Al wire bonding; complex but robust
    • Immersion silver: Reworkable and cost-effective but sensitive to handling and prone to creep corrosion
  • button icon Advanced and emerging finishes
    • ENEPIG – Thin Ni: Lower insertion loss, fine line compatibility, and improved economics
    • RAIG: How it addresses hyper-corrosion through deposition chemistry
    • EPIG & EPAG: Nickel-free options for fine lines and better signal integrity
    • ISIG: Proven performance with fine lines and low loss, but process complexity
    • DIG: Cost-effective and high-SI performance, with limitations on Al wire bonding
  • button icon Insertion loss comparisons
    • • Comparative SI performance for ENIG, ENEPIG, ENEPIG-Thin Ni and EPIG
Jose Garcia's about image

About Jose Garcia

Jose Garcia is a member of Uyemura USA as a Field Engineer in Northern California. Garcia’s responsibilities include process troubleshooting, process reviews, chemical installations and assisting customers with root cause analysis. He is an expert in choosing reliable surface finishes! Garcia holds a Bachelor of Science, Chemical Engineering from San Jose State University.

Talk to a Sierra Circuits PCB Expert today

24 hours a day, 7 days a week.

Call us: +1 (800) 763-7503
Book a Meeting with a Sales Rep
Email us: through our Customer Care form