Webinar: Fixing the DFM Mistakes that Slow Down SpaceX PCB Fabrication

Webinar abstract:

Every aerospace mission depends on electronics that must operate flawlessly under extreme vibration, radiation exposure, and vacuum conditions. In such environments, even small PCB design oversights might compromise reliability. Design intent may be electrically sound, yet translating that into a manufacturable board remains a critical challenge.

This webinar is tailored specifically for SpaceX designers and hardware engineers. You will learn the space-grade DFM and DFA rules to support essential aerospace innovation.

Critical DFM and DFA principles SpaceX engineers should follow

While collaborating with aerospace partners, we have seen how even minor oversights in design documentation can cascade into production delays. When your design files lack clarity or include incomplete fabrication notes, it might lead to misinterpretation during manufacturing. A stack-up diagram may show one structure while the layer files suggest another, or naming conventions may not follow IPC-7351. These discrepancies might introduce ambiguity, and in space hardware, ambiguity becomes risky.

You must provide complete, unambiguous design data and a stack-up diagram that labels every signal layer, plane, prepreg, and core.

The next critical decision lies in material selection. Laminates that look ideal on datasheets may not be available in the required thickness or dielectric constant. Your impedance targets may not be achievable with the materials you initially choose. You should evaluate dielectric properties (Tg, Dk, Df), copper weights, and layer-thickness constraints to ensure the stack-up is both electrically accurate and manufacturable.

Drilling introduces another set of hidden hazards. If you allow less than 7 mil drill-to-copper clearance, it might cause internal shorts during plating. Selecting drill sizes without considering manufacturing tolerances often results in insufficient annular rings. To address this issue, you must incorporate ±3 mil drill tolerance for plated holes and ±5 mil for routed slots.

Even silkscreen design, often treated as an afterthought, might create major assembly challenges. Overlapping reference designators, unclear polarity markings, or text placed too close to pads might lead to rework. Maintain at least 6 mil silkscreen-to-copper spacing to ensure readability.

From silkscreen, you transition into DFA considerations. Efficient assembly depends on how you communicate requirements clearly. You must specify part orientations, mechanical dimensions, and special handling notes in your assembly notes. In addition to that, prepare an unambiguous BOM with correct MPNs, accurate descriptions, and precise quantities to eliminate sourcing errors.

The webinar concludes with a live Q&A, where Sierra Circuits’ experts will address your questions and share their insights on space-grade DFM and DFA rules from decades of hands-on expertise in PCB fabrication and assembly.

By the end of the session, you will have a clear understanding of the most common design mistakes seen in high-performance aerospace electronics and the space-grade DFM and DFA rules you must apply to eliminate these issues before they reach manufacturing.