As high-speed designs push the limits of performance, signal and power integrity become more critical than ever, especially when working with ultra-thin laminates. In this webinar, we’ll explore how to successfully design PCBs for manufacturing while maintaining the electrical performance your application demands.
We’ll start by covering where designers often go wrong when it comes to DFM, and how to avoid costly mistakes early in the design process. You’ll learn best practices for selecting materials, planning your stack-up, optimizing trace widths and spacing, and managing vias, including via-in-pads.
From there, we’ll dive into what manufacturers actually need from your design files to ensure a successful build.
Then, we’ll take a closer look at FaradFlex’s material characteristics and how thin and high-DK laminates affect the impedance of the power distribution network. Critically, we will look at how spacing and dielectric constant between power and ground layers affects inductance at high frequencies.
We’ll also cover strategies for reducing EMI noise and how to improve signal integrity by optimizing the return path copper roughness.
