Webinar: Designing for Manufacturing from PCB Stack-Up to Assembly Success

Webinar abstract:

When designing high-speed PCBs, you would have nailed the schematic and layout, but your product might still fail if your stack-up isn’t built right. For a reliable stack-up, stick to PCB design for manufacturing guidelines. It helps you avoid expensive board respins and unexpected production delays.

In this webinar, you’ll learn how to build high-speed PCB stack-ups that prevent crosstalk and impedance discontinuities. You’ll also get familiarized with PCB design for manufacturing strategies to ensure your board performs as intended.

Managing signal integrity and heat dissipation challenges in your stack-up

Material selection plays a critical role in high-speed PCB stack-up design. The wrong material might lead to signal loss, thermal instability, or even board failure. For designs above 5 Gbps, opt for materials with low loss tangents (D_f < 0.005). Ensure consistent D_k for uniform impedance across layers. You also need to consider the T_g of your material; a T_g above 170°C is ideal to avoid delamination during multiple reflow cycles.

When designing for high-speed build-up, use ground planes adjacent to signal layers to provide an uninterrupted return path. For example, an 8-layer configuration like Signal – GND – Signal – Power– GND – Signal – GND – Signal helps mitigate EMI and signal coupling. Additionally, keep your stack-up symmetrical to prevent warpage during lamination.

Next, focus on designing circuits with uniform impedance. Place signal layers 1-dielectric away from the reference planes to enhance noise suppression. Maintain consistent spacing between signal traces and avoid parallel routing to minimize crosstalk. Use stitching vias to provide a continuous return path.

Thermal performance should also be baked into your stack-up design, especially when dealing with high-current circuits. Use thick copper for power planes (2 oz). Place arrays of thermal vias with 0.3 mm diameter and 0.8 mm pitch under heat-generating components like power amplifiers.

Remember, a great stack-up design isn’t just about electrical performance; it must also be manufacturable. That’s why it’s essential to consult your CM early and follow their PCB design for manufacturing guidelines. The choices you make in your stack-up, material, and layout must align with your manufacturer’s capabilities.

Whether you’re working on a compact IoT sensor or a complex RF system, these design for manufacturing strategies will help you to build high-performance, production-ready circuit boards with confidence.

Register for this webinar to gain practical insights on stack-ups and design for manufacturing.