Webinar: Characterization of High-Frequency Transmission Lines for Signal Integrity optimization
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December 10th, 2025 | 10 AM PT
COST: FREE
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24
Days
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9
Hours
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19
Minutes
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36
Seconds
Amit Bahl
CRO at Sierra Circuits
Mohan Puntambekar
Applications Engineer
This webinar will be hosted on Zoom.
Following this event, you will receive:
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Slides
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Recording
Webinar abstract:
As data rates continue to rise and designs push further into the GHz range, maintaining signal integrity becomes one of the most critical aspects of high-speed PCB design. This webinar—presented in collaboration with Rohde & Schwarz—explores practical techniques for characterizing and optimizing high-frequency transmission lines to ensure reliable performance.
Attendees will gain a deeper understanding of microstrip, stripline, and coplanar waveguide structures, and learn how to address common issues such as insertion loss, impedance mismatch, reflections, and timing skew. We’ll also cover stack-up design and laminate selection, via and trace optimization, and shielding strategies for minimizing signal degradation.
The session concludes with a hands-on look at signal integrity measurement techniques including TDR, S-parameters, and time/frequency domain analysis, along with an SI checklist to guide robust PCB designs at high frequencies.
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Webinar agenda:
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High-frequency signal integrity: challenges and key concepts
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Transmission lines: microstrip, stripline, and coplanar waveguide
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Common issues: insertion loss, impedance mismatch, reflections, timing skew
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Stack-up and laminate optimization for minimal signal degradation
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Via management and trace spacing to control attenuation and parasitics
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Shielding and connector/interface considerations
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SI measurement techniques: TDR, S-parameters, frequency and time domain analysis
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Fault finding, gating, and evaluating test results
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SI checklist for robust GHz PCB designs
Amit Bahl, CRO at Sierra Circuits
Amit Bahl, widely recognized as the PCB Guy, currently serves as the Chief Revenue Officer at Sierra Circuits. He earned his Bachelor of Science in Engineering from UCLA in 1997, launching his career in Silicon Valley’s tech industry. In 2009, he assumed the role of Director of Sales and Marketing at Sierra Circuits, with a dedicated focus on democratizing design for manufacturing best practices and guidelines for PCB designers and engineers.
Assuming the position of Chief Revenue Officer since 2022, Amit’s mission persists: to simplify the PCB design journey for all stakeholders. His unwavering dedication continues to drive Sierra Circuits as a trusted resource for the PCB design community.
Mohan Puntambekar, Applications Engineer at Rohde & Schwarz
Mohan is an Applications Engineer at Rohde & Schwarz North America, specializing in vector network analyzer (VNA) applications. He brings extensive experience from previous roles at Anritsu, Qualcomm, and Lucent Technologies, where he worked on a range of microwave design, testing, and measurement projects. Mohan holds B.S. and M.S. degrees in Engineering from Coventry University and the University of Leicester in the United Kingdom.
