Seminar: Science-Based HDI Via Design by Daniel Beeker
Daniel Beeker
Technical Director
NXP Semiconductors
Date and time:
September 6th, 2023
From 9:00 AM to 4:00 PM Pacific time
Location: This event will be hosted online via Zoom
Price: $245
Science-based HDI via design in four parts:
Beginning with a review of electromagnetic field behavior, this webinar will cover basic rules for PCB design, with a focus on board stack-up and proper design of HDI vias. It’s all about the space!!
Part 1: Electromagnetic fields for normal folks: Show me the pictures and hold the equations, please!
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how understanding EM field behavior can help design PCBs that will be more robust and have better EMC performance. This is not rocket science but an easy-to-understand application of PCB geometry.
Part 2: Effective PCB design: Techniques to improve performance
As IC geometries continue to shrink and switching speeds increase, designing electromagnetic systems and printed circuit boards to meet the required signal integrity and EMC specifications has become even more challenging. A new design methodology is required. Specifically, the utilization of an electromagnetic physics-based design methodology to control the field energy in your design will be discussed. This training module will review the development process and provide guidelines for building successful, cost-effective printed circuit boards. After introducing EM field behavior, this course will describe several effective methods for designing the spaces used to direct EM fields on a PCB. Simple rules for managing these fields will be described, based on one fundamental behavior. How fast does the switch change states? This defines the requirements for the power distribution and the geometry of the space between the output of the switch and the receiver. Several real-world examples of the use of these principles, both for designing compliant boards and for analyzing EMC failures are presented.
Part 3: Stacking the deck: Maximizing the PCB layer design for signal integrity and EMC performance
This session will focus on the importance of understanding the role of the PCB layers in directing the signal and power supply energy between the board layers. The focus is on knowing which dielectric you are using, and how to move that energy between dielectric layers in the PCB.
Part 4: HDI via design: Planning the energy pipelines
This session will focus on the importance of understanding the advantages and limitations of high density via usage. The key is understanding how to connect the signals and grounds through the board stackup. It is also essential to understand what is needed to provide the proper thermal connections between the ICs and ground planes.
About Daniel Beeker
With more than 42 years of experience in electronic system design and EMC, Daniel Beeker provides application support for NXP Automotive customers worldwide. Daniel also supports NXP customers globally with special function development tools and instrumentation. Daniel specializes in EMC and signal integrity design techniques for systems and PCBs, especially in low-layer count designs. In support of this, Daniel has completed more than 250 PCB design evaluations for customers and internal NXP products. Daniel teaches field-based design techniques at NXP and industry conferences worldwide, with more than 150 sessions with more than 6000 attendees since 2010. Daniel is also involved with NXP IC package design and IC development tool teams to support improved EMC performance, working on more than 25 IC designs.
Daniel’s unique approach to EMC is the result of many years of collaboration with one of the fathers of our industry, Ralph Morrison, whose foundation textbook, “Grounding and Shielding Techniques,” was published in 1967. Ralph’s science-based approach to design has formed the basis for Daniel’s design philosophy, which has resulted in consistent success in both his designs and those of his students. Daniel also attributes his success to his association with another industry leader, Rick Hartley. The influence of these two extremely knowledgeable mentors can be seen in Daniel’s material and his passion for sharing this perspective with the engineering community.
Daniel was the first recipient of UBM Publishing’s 2017 Annual Creativity in Electronics (ACE) Award as the Embedded Systems Conference (ESC) Speaker of the Year and was a Keynote speaker at Altium Live 2017 in San Diego and Altium Live 2019 in Munich. Dan is a regular presenter at both PCB East/West and DesignCon/Embedded Systems conferences, IEEE EMC Society and NXP training events, as well as special events hosted by Sierra Circuits. Daniel is also a major contributor to PCB Africa, which is a project to increase the expertise in the central Africa electrical engineering community.
If you have questions about the class, email Lucy.
