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Seminar: Best PCB Design Practices to Reduce Signal Integrity Problems by Dr Eric Bogatin

Headshot of Dr Eric Bogatin

Dr Eric Bogatin

SI Evangelist
Teledyne LeCroy

Date and time:

September 15th, 2023

From 9:00 AM to 5:00 PM Pacific time

Location: This event will be hosted online via Zoom

Price: $245


How to reduce signal integrity problems

When interconnects are not transparent, they will only create noise in your system. To reduce this noise, you must understand the root cause and fix the problem at the root cause. Whole books have been written on this topic (I wrote 4 of them), dozens of short courses are available (I’ve taught six of them) and many university courses (I teach 4 of these) are available that cover these topics. But, if you only have 6 hours to learn everything you need to know about SI problems and solutions, this six-hour course is the one you should take to learn how to reduce your SI problems in your next board designs.


The topics covered in this 6-hour short course are:

1. A strategy for PCB design for SI
2. Signals, rise time and bandwidth
3. Re-thinking signal propagation and ground bounce
4. PDN design and decoupling capacitors
5. Controlled impedance, reflections and discontinuities
6. Differential pair design and length matching
7. Routing and termination strategies
8. Cross talk
9. “Noisy grounds” and split grounds
10. Via design, stack up and layer transitions
11. High speed serial links and lossy interconnects


About Dr Eric Bogatin

Eric is a professor at the University of Colorado, Boulder, in the ECEE department where he teaches classes on system design, circuit design, and signal integrity. He is the technical editor of the Signal Integrity Journal and a Fellow with Teledyne LeCroy.

He has been teaching and writing on signal integrity topics for 40 years. He received his BS in Physics from MIT in 1976 and MS and PHD in physics from the University of Arizona, Tucson in 1980.


If you have questions about this class, email Lucy.

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