Seminar: Designing for High Speed, Signal Integrity and EMI Without Using Simulation
Senior PCB Design Engineer
Date and time:
April 18th, 2024
From 9:00 AM to 4:00 PM Pacific time
Location: This event will be hosted online via Zoom
Designing for high speed without simulation
There is no doubt that designing a printed circuit board is a complex undertaking, incorporating all the electronics and physics needed for quality boards. One of the tools often used to help predict that the signals and board are being laid out well is simulation. However, not every company has a simulation specialist (or tool) that can be utilized for that effort.
This presentation will discuss manual design skills, that when implemented will set up high-quality boards with low noise, good signal integrity, no EMI concerns, are manufacturable, and perform well while in service. Parts can be placed and routing can be done in a manner that will help to control interference, while not creating antennas. The power and ground distribution can be carefully planned with plane and capacitor placement so that the design will be able to handle the power needs of the parts while in operation. We will also explore how signals flow on and through the layers of the board, the return current movement, impedance control, and controlling high frequency energy, all for the best signal solutions. That will also include discussion of spacing, planes, stack-up, layer paired routing, and more. We will then discuss some DFM issues, so that the designer can use this manufacturability knowledge to help get the best possible results for a high quality, cost efficient board.
1. Explanation of the electronics and physics involved
2. Impedance control helps control energy spread
3. Spacing issues help control crosstalk
4. Containing return current keeps the loop area to a minimum
5. Planes, routing layers, and stackup
6. Power distribution issues
7. Control of highest frequency energy
8. Placement issues for signal integrity and EMI
9. Routing, signal flow and controlling the layer pair
10. Design for DFM — high yield and low cost
About Susy Webb
Susy Webb is a senior PCB design engineer with over 45 years of experience. Her career includes experience in coastal and oceanographic oil exploration and monitoring equipment, point-to-point microwave network systems, and CPCI and ATX computer motherboards. Webb is a regular speaker at PCB Conferences, IPC events, international design conferences, and has consulted for individual companies and groups as well for the last 18 years.. Her presentations discuss practical implementation of complex engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She is CID certified, a former writer/columnist for Printed Circuit Design and Fab magazine, a chapter writer for Clyde Coombs “Printed Circuits Handbook”, one of the writers of the PCB-EDU book and curriculum, and one of the judges for the annual TLA competition. Webb is also an active member of the PCEA Executive Board and education committees, and is a member and past president of the Houston Chapter of the Designer’s Council.